Wafer Laser Processing with Multi-Point Condensing Control
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Solution Overview
Problem
The existing wafer separation methods using laser-induced modification layers are inefficient due to the time-consuming process of forming modification layers one by one, leading to reduced productivity and throughput in wafer processing systems.
Innovation Solution
A wafer processing system equipped with a modifying apparatus that uses a spatial light modulator to simultaneously form multiple condensing points within the wafer, allowing for the simultaneous formation of internal and peripheral modification layers, thereby improving the efficiency of wafer separation and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If modification layers are formed one by one using conventional laser processing methods, then the processing precision and quality of each modification layer are maintained, but the productivity and throughput of wafer processing are reduced due to the time-consuming sequential process
Solution Approach 1:
The laser beam is divided into multiple independent condensing points that can simultaneously form multiple modification layers at different depths and positions within the wafer. This segmentation of the single laser beam into multiple focal points enables parallel processing of multiple modification layers, dramatically improving throughput while maintaining the quality of each individual modification layer.
Solution Approach 2:
The patent extends the modification layer formation from a single-plane sequential process to a multi-dimensional simultaneous process by creating condensing points at different depths (Z-axis) and positions (X-Y plane) within the wafer. This multi-dimensional approach allows multiple modification layers to be formed concurrently throughout the wafer thickness, transforming the processing from a time-consuming sequential operation to a parallel multi-dimensional operation.
2Productivity
If multiple condensing points are formed simultaneously using laser light, then the productivity and throughput are improved, but the control precision and uniformity of condensing point arrangement require sophisticated mechanisms
Solution Approach 1:
The patent employs dynamic control mechanisms including rotating the wafer at controlled speeds and moving the laser beam dynamically to create precisely arranged condensing points. The rotation speed and laser scanning speed are coordinated to ensure uniform spacing and proper arrangement of multiple condensing points throughout the wafer, maintaining manufacturing precision while enabling simultaneous multi-point processing.
Solution Approach 2:
The system incorporates feedback control to monitor and adjust the positions and arrangements of condensing points in real-time. By monitoring the actual positions of modification layers formed and comparing them with the target arrangement, the system can dynamically adjust laser parameters and wafer rotation to correct any deviations, ensuring precise arrangement of condensing points while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the throughput and productivity of wafer processing by enabling the simultaneous formation of multiple modification layers, improving the efficiency of wafer separation and reducing processing time.
Implementation Method 1
a modifying device configured to form multiple condensing points along a plane direction of the processing target object by radiating laser light to an inside of the processing target object
Data Source
AI summary
A processing apparatus includes a controller configured to control an operation of forming condensing points in a processing target object. In forming the condensing points by radiating a laser light to an inside of the processing target object periodically from a modifying device while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by a moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in a plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.