Wafer-Level Black Coating for Camera Cubes
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Solution Overview
Problem
Current black coating processes for camera cubes are slow and labor-intensive due to the need for manual masking and removal of coating layers on individual lens/sensor groups, which limits efficiency and scalability.
Innovation Solution
A method for black coating camera cubes at the wafer level involves stretching a tape to increase the gap between cubes, applying a black coating material, laser trimming unwanted areas, and lifting off the coating material, allowing for simultaneous processing of multiple units and reducing manual handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual masking and coating processes are used for individual lens/sensor groups, then precise control over black coating application is achieved, but processing time and labor intensity increase significantly
Solution Approach 1:
Multiple individual lens/sensor groups are merged into a single wafer-level processing operation. The patent applies black coating material to the entire wafer surface simultaneously, then uses laser trimming to define individual patterns, eliminating the need to handle and mask each component separately while maintaining precise coating control.
Solution Approach 2:
The patent replaces manual mechanical masking operations with automated laser trimming. Instead of physically applying and removing masks from each component, a laser systematically trims the wafer surface to define precise black coating patterns, substituting manual mechanical work with automated optical processing.
2Manufacturing precision
If individual lens/sensor groups are processed separately with manual handling, then precise coating control is maintained, but the process becomes labor intensive and slow
Solution Approach 1:
The patent applies black coating material to the entire wafer surface in advance before defining individual component boundaries. This preliminary bulk coating operation covers all components simultaneously, and subsequent laser trimming precisely removes material only where needed, achieving precise control while dramatically reducing total processing time.
Solution Approach 2:
The patent segments the continuous black coating layer into individual patterns for each lens/sensor group through laser trimming. Instead of processing each component separately from the start, the continuous coating is divided into discrete functional patterns after application, enabling efficient batch processing with precise final definition.
3Manufacturing precision
If manual masking material is applied to each die, then precise aperture protection is achieved, but the process requires extensive manual labor and time
Solution Approach 1:
The patent replaces the manual mechanical process of applying and removing masking material with an automated laser trimming system. The laser precisely defines aperture boundaries by removing material, eliminating the need for manual mask application while maintaining or improving positioning accuracy through automated control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces processing time and manual effort by enabling the handling of entire wafers at once, increasing efficiency and scalability, and maintaining precise control over the black coating application.
Implementation Method 1
laser trimming a pattern within the layer of black coating, the pattern defining undesired portions of the black coating material to be removed
Data Source
AI summary
A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.