Wafer-Level Homogeneous Bonding Optical Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wafer-level optical structures face issues with bow distortion and interlayer misalignment due to thermal treatment, which affects the alignment and deformation of polymeric layers on glass wafers, leading to defective optical performance.
Innovation Solution
A method for forming a wafer-level homogeneous bonding optical structure without thermal treatment, using laser treatment to bond spacers directly to an optically transparent wafer or substrate, eliminating the need for heterogeneous adhesives and preventing bow distortion and misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal treatment is applied to fix spacers on the lens layer, then spacers are firmly fixed on the lens layer, but bow distortion occurs due to thermal expansion difference between polymeric layer and glass wafer
Solution Approach 1:
The patent replaces the thermal bonding process with a mechanical bonding approach using a dry film adhesive layer. Instead of applying heat to activate bonding (thermal treatment), the dry film provides mechanical adhesion through its adhesive properties, allowing spacers to be firmly fixed without subjecting the polymeric layer to thermal stress that causes bow distortion.
Solution Approach 2:
The patent changes the bonding mechanism from thermal activation to adhesive bonding at ambient or controlled conditions. By using a dry film with specific adhesive properties, the bonding process occurs without the need for high temperature treatment, thereby preventing thermal expansion differences from causing substrate deformation while still achieving strong spacer fixation.
2Strength
If thermal treatment is applied to process the dry film, then spacers are firmly fixed, but interlayer misalignment occurs due to bow distortion
Solution Approach 1:
The patent replaces thermal processing with mechanical adhesive bonding using a dry film. This substitution eliminates the bow distortion that occurs during thermal treatment, thereby preventing the regional shift and interlayer misalignment that would otherwise occur, while still achieving firm spacer fixation through the adhesive properties of the dry film.
3Strength
If thermal treatment is applied close to glass transition temperature, then dry film bonding is activated, but polymeric layer deformation occurs
Solution Approach 1:
The patent changes the bonding activation method from thermal processing near the glass transition temperature to adhesive bonding using a dry film at lower temperatures. This parameter change prevents the polymeric layer from deforming while still achieving strong bonding between the spacer and lens layer through the dry film's adhesive properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in improved optical performance and interlayer alignment accuracy, eliminating bow distortion and misalignment issues, leading to better product quality and appearance.
Implementation Method 1
a laser treatment is carried out on the interfaces between the spacers and the optically transparent wafer
Implementation Method 2
a laser treatment is carried out on the interfaces between the spacers and the optically transparent wafer so that the spacers are homogeneously bonded
Data Source
AI summary
A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.