Wafer-Level Encapsulation for Implantable Electrodes
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Solution Overview
Problem
Conventional methods for manufacturing implantable electrodes are labor-intensive and prone to fluid leakage due to device-level encapsulation, which limits batch processing and provides inadequate protection against moisture absorption.
Innovation Solution
A method involving wafer-level encapsulation, where a base with a frame and center portion is used to suspend devices, allowing for conformal coating and subsequent exposure of electrode sites, utilizing deep reactive ion etching and polymer materials like parylene for encapsulation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If device-level encapsulation is used, then individual electrode sites can be exposed, but labor intensity increases and batch processing is precluded
Solution Approach 1:
The encapsulation process is segmented into wafer-level encapsulation followed by individual site exposure. Multiple devices on a wafer are encapsulated simultaneously as a group, then individual electrode sites are exposed after encapsulation. This segmentation enables batch processing while maintaining the ability to access specific electrode sites individually.
Solution Approach 2:
Encapsulation is performed as a preliminary action at the wafer level before individual device processing. By encapsulating multiple devices simultaneously at the wafer level first, the process enables batch processing efficiency, and subsequent individual site exposure can be performed on already-encapsulated devices without compromising the encapsulation integrity.
2Reliability
If device-level encapsulation is used, then individual protection can be provided, but manufacturing complexity increases
Solution Approach 1:
Multiple devices are merged into a single wafer-level encapsulation process. Instead of processing each device separately for encapsulation, all devices on the wafer are encapsulated simultaneously in one batch process, reducing manufacturing complexity while maintaining individual protection for each device through the conformal nature of the encapsulation layer.
3Productivity
If sandwiching technique is used for wafer-level coating, then batch processing is enabled, but fluid leakage between layers occurs
Solution Approach 1:
A conformal encapsulation layer is applied as a continuous thin film over the entire wafer surface, creating a seamless barrier that prevents fluid leakage between layers. This conformal coating approach replaces the sandwiching technique, maintaining batch processing capability while providing reliable fluid leakage prevention through a continuous encapsulation layer that follows the wafer's topography.
4Reliability
If conventional dielectric coating is applied, then moisture protection is improved, but labor intensity increases due to device-level processing
Solution Approach 1:
The manufacturing process is segmented into wafer-level encapsulation followed by individual site exposure. By performing the moisture-protective encapsulation at the wafer level first, multiple devices are protected simultaneously in one batch process, significantly reducing labor intensity. Subsequent individual site exposure is performed on already-protected devices, maintaining moisture protection while enabling efficient manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces labor intensity, enables batch processing, and provides effective protection against moisture absorption while maintaining electrical insulation, enhancing the reliability and efficiency of implantable electrode manufacturing.
Implementation Method 1
Conventional implantable electrodes are coated with dielectrics to provide increased protection from moisture absorption
Implementation Method 2
electrode sites must be exposed individually on each device, typically with laser ablation
Implementation Method 3
utilizing deep reactive ion etching and polymer materials like parylene for encapsulation and protection
Data Source
AI summary
The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.