Wafer-Level LED Chip Package for High-Yield Assembly
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Solution Overview
Problem
The light-emitting diode (LED) chip packaging industry faces challenges in increasing yield without adding manufacturing steps or costs, particularly in arranging multiple LED chips with high accuracy and simplifying the process of using fluorescent sheets and carrier substrates.
Innovation Solution
The implementation of a wafer level chip scale packaging method, where multiple LED chips are formed in one piece and electrically connected, allowing for direct placement on a substrate with a metal terminal, eliminating the need for complex cutting and carrier substrates, and utilizing a fluorescent sheet that does not require precise cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple LED chips are arranged using conventional packaging methods, then each chip can be individually handled, but the manufacturing complexity increases and yield decreases due to multiple cutting and assembly steps
Solution Approach 1:
Multiple LED chips are integrated into a single chip set that is packaged as one unit. The chip set includes a substrate with multiple LED chip structures formed thereon, allowing multiple chips to be handled and packaged simultaneously rather than individually, thereby reducing manufacturing complexity and improving yield
Solution Approach 2:
The LED chips are pre-formed and electrically connected on a substrate before packaging. This preliminary integration allows the entire chip set to be packaged in one operation, eliminating subsequent cutting and assembly steps that would increase complexity and reduce yield
2Illumination intensity
If fluorescent sheets are used with conventional packaging, then light emission can be achieved, but precise cutting and positioning are required which increases manufacturing difficulty
Solution Approach 1:
The fluorescent sheet is integrated with the chip set as a single assembly unit. The chip set structure allows the fluorescent sheet to be positioned and attached without requiring precise cutting, as the entire chip set is treated as one packaging unit rather than requiring individual chip-level precision
3Reliability
If carrier substrates are used in conventional packaging, then chip support and electrical connection are achieved, but additional materials and steps are required which increases cost
Solution Approach 1:
The substrate within the chip set serves multiple functions: it provides mechanical support for the LED chip structures, establishes electrical connections between chips, and eliminates the need for separate carrier substrates. This multi-functional design reduces material requirements and manufacturing steps, thereby lowering cost while maintaining reliability
Solution Approach 2:
The carrier substrate function is extracted and integrated directly into the chip set substrate. By incorporating the support and connection functions into the chip set itself, the separate carrier substrate is eliminated, reducing material cost and simplifying the manufacturing process
4Ease of manufacture
If gaps exist between light-emitting areas, then chip arrangement is easier, but emission intensity decreases
Solution Approach 1:
Multiple LED chip structures are integrated closely on a single substrate forming a chip set with minimal gaps between light-emitting areas. The unified substrate allows precise positioning of multiple chips in close proximity, achieving high emission intensity while maintaining manufacturing ease through the integrated chip set approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances emission intensity by minimizing gaps between light-emitting areas, simplifies the manufacturing process, and improves product longevity through efficient heat dissipation.
Implementation Method 1
The recombination radiation of electron and hole may produce electromagnetic radiation (such as light) through the current at the p-n junction
Implementation Method 2
electromagnetic radiation in the non-visible region may be transferred to visible light through phosphorous lenses
Data Source
AI summary
An LED chip package includes a substrate having a metal terminal (gold finger structure). A LED chip set is composed of a plurality of LED chips formed in one piece, and has a plurality of light-emitting areas which are separated from each other. The LED chip set is disposed on the substrate and electrically connected to the metal terminal.