Wafer-Level LED Package Eliminating Bond Wires

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional LED packaging schemes, which rely on carriers and bond wires, impose physical limitations on package size, making it difficult to achieve extremely compact light sources for applications like consumer electronics.

Innovation Solution

The integration of discrete light sources and a jumper chip into a single piece of mold material without a carrier, using wafer manufacturing processes to create electrical contacts and eliminate the need for bond wires, allowing for a wafer-like format with solder balls for electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional LED packaging with carriers and bond wires is used, then electrical connections can be established, but package size is limited and cannot be made extremely compact

Engineering Contradiction:

Improvepackage sizeVSAvoidpackaging structure

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent removes the traditional carrier substrate and bond wire interconnect structure from LED packaging. By extracting these components, the invention achieves a carrier-less package format that dramatically reduces package size and eliminates the physical limitations imposed by conventional mounting structures.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the LED die, mold compound, and electrical interconnect functions into a single integrated wafer structure. The wafer-level packaging process combines multiple manufacturing steps and components into one unified structure, eliminating the need for separate carrier, bond wires, and encapsulation stages.

Inventive Principle:

Principle #5Merging (Combining)

2Length of stationary object

If bond wires are used for electrical connections, then p- and n-contacts can be connected to the carrier, but the package height increases and fragility is introduced

Engineering Contradiction:

Improvepackage heightVSAvoidbond wire fragility

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The patent replaces the mechanical bond wire interconnect system with a direct wafer-level electrical contact system. Conductive pathways are formed through the mold compound during wafer fabrication, eliminating the need for fragile wire bonds and reducing package height to wafer thickness levels.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If carrier-based mounting is used, then LED die can be mounted and wired, but the physical limit on how small the package can be produced is reached

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing process

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent performs electrical interconnect formation during the wafer fabrication process itself, before dicing and packaging. Conductive pathways are pre-formed through the mold compound in the wafer stage, eliminating subsequent wire bonding steps and enabling direct assembly of ultra-compact packages.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9142746B2Light-emitting diodes on a wafer-level package

Publication Date: 2015.09.22 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.