Wafer Level MEMS Sensor Assembly with Integrated ASIC
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Solution Overview
Problem
Existing MEMS sensor device assembly solutions face challenges in achieving compact dimensions, low manufacturing costs, and high performance, particularly in the design of acoustic transducers, which are constrained by the need for separate dice and packages that limit freedom in sizing and increase assembly costs.
Innovation Solution
The solution involves integrating the micromechanical detection structure and the corresponding ASIC onto the same dice, eliminating the need for a separate package, with external surfaces of the dice forming direct mechanical and electrical interfaces to the external environment, allowing for reduced dimensions and optimized chamber sizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the micromechanical detection structure and ASIC are integrated onto the same die, then the device dimensions are reduced and manufacturing cost is lowered, but electromagnetic interference from external environments may affect sensor performance
Solution Approach 1:
The patent integrates the micromechanical detection structure and ASIC onto the same die, eliminating the need for separate packaging and reducing overall device volume. This merging of components directly addresses the need for compact dimensions in portable devices while maintaining functional performance.
Solution Approach 2:
The patent acknowledges electromagnetic interference as an unavoidable external factor but converts this challenge into an opportunity by designing the integrated structure to minimize antenna effects and optimize signal routing. The direct integration allows for shorter signal paths and reduced electromagnetic radiation, turning the potential harm of integration into a benefit through careful structural design.
2Ease of manufacture
If the micromechanical detection structure and ASIC are integrated onto the same die, then manufacturing cost is reduced and production is simplified, but electrical characteristics and signal integrity may be compromised
Solution Approach 1:
The integration of micromechanical detection structure and ASIC on the same die eliminates separate packaging steps, reduces assembly complexity, and lowers manufacturing costs. The unified structure allows for streamlined production processes while maintaining electrical performance through optimized design.
Solution Approach 2:
The patent employs intermediate buffering structures and optimized signal routing pathways within the integrated die to maintain signal integrity. These intermediary elements act as mediators between the micromechanical sensors and ASIC, ensuring reliable electrical characteristics despite the close integration, thereby preserving signal quality while enabling cost-effective manufacturing.
3Volume of moving object
If the micromechanical detection structure and ASIC are integrated onto the same die, then the device achieves compact dimensions for portable applications, but the complexity of designing and optimizing the integrated structure increases
Solution Approach 1:
The patent achieves compact device dimensions by merging the micromechanical detection structure and ASIC onto the same die. This integration eliminates the need for separate packaging and reduces overall device volume, making it suitable for portable electronic applications where space is at a premium.
Solution Approach 2:
The patent applies local quality optimization by tailoring specific regions of the integrated structure for different functions. The micromechanical detection areas are optimized for sensitivity and acoustic performance, while the ASIC regions are optimized for signal processing. This localized optimization approach manages design complexity by addressing each functional area with specialized design criteria rather than requiring uniform optimization across the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, cost-effective MEMS sensor device assembly with enhanced performance, simplified manufacturing, and improved electrical characteristics, enabling efficient detection of multiple environmental quantities using a single ASIC.
Implementation Method 1
The micromechanical detection structure, designed to transduce a mechanical quantity to be detected (for example, acoustic waves, pressure, etc.) into an electrical quantity (for example, a capacitive variation)
Implementation Method 2
a mobile electrode, provided as a diaphragm or membrane, facing a substantially fixed electrode. The mobile electrode is generally anchored, by means of a perimetral portion thereof, to a substrate, whilst a central portion thereof is free to move or bend in response to acoustic-pressure waves incident on a surface thereof
Data Source
AI summary
An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.