Wafer Transfer Manipulator With Edge Support to Prevent Scratches

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Solution Overview

Problem

Existing manipulators cause scratches and contact marks on the front surface of wafers during transfer due to direct contact, especially in processes like back metal deposition where wafers are curled, leading to reduced yield and product quality.

Innovation Solution

A manipulator design with support members arranged circumferentially, each contacting the wafer's edge to prevent direct contact with the surface, utilizing anti-slip flexible members and inclined surfaces to stabilize and reduce friction, thereby minimizing scratches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional structure with separate positioning mechanisms is used for each degree of freedom, then positioning precision can be maintained, but the device complexity and number of parts increase significantly

Engineering Contradiction:
Improvepositioning precisionVSAvoidnumber of parts
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple positioning functions into a single brake shoe component. The brake shoe simultaneously provides positioning in radial direction (first degree of freedom), axial direction (second degree of freedom), and angular direction (third degree of freedom) through its integrated structure with brake pads on both sides, eliminating the need for separate positioning mechanisms for each degree of freedom.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The brake shoe is designed as a multi-functional component that performs multiple positioning tasks. It acts as both a braking element and a positioning element, providing constraints in three different degrees of freedom simultaneously, thereby reducing the overall number of parts required in the manipulator system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple brake shoes are used to constrain different degrees of freedom, then positioning reliability improves, but the device complexity and maintenance difficulty increase

Engineering Contradiction:
Improvepositioning reliabilityVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the functions of multiple brake shoes into a single integrated brake shoe assembly. This assembly includes brake pads on both sides of a central support structure, allowing one component to perform the positioning function that would otherwise require multiple separate brake shoes, thereby maintaining reliability while reducing complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Volume of moving object

If a compact manipulator design is implemented, then the size reduction is achieved, but the brake shoe may contact multiple linkages simultaneously causing interference

Engineering Contradiction:
Improvemanipulator sizeVSAvoidmechanical interference
Core Design Contradiction:
Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by creating localized contact zones for the brake pads. Each brake pad is positioned to contact only its designated linkage at specific operational positions, ensuring that even in a compact design, the brake shoe does not cause interference with other linkages. The asymmetric positioning of brake pads on the support structure enables selective, localized contact.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The brake shoe is segmented into multiple independent brake pads mounted on a common support structure. This segmentation allows each brake pad to independently contact its target linkage without interfering with other brake pads or linkages, enabling compact manipulator design while avoiding mechanical interference through spatial separation of contact zones.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP4213192B1manipulator
Publication Date: 2026.04.29 BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
  • EP4213192B1 patent drawingFigure 1A
  • EP4213192B1 patent drawingFigure 1B~1C
  • EP4213192B1 patent drawingFigure 2A~2B

AI summary

The manipulator of embodiments of the present disclosure is configured to transfer a wafer and includes a finger structure and a plurality of support members. The plurality of support members are arranged at the finger structure and distributed at intervals on a same circumference. Each support member is configured to contact an edge of the wafer to support the wafer to prevent the wafer from contacting the finger structure. With the manipulator of embodiments of the present disclosure, the wafer is prevented from contacting the finger structure to avoid scratches and contact marks generated at the surface of the wafer.