Wafer Marking Using Ingot Data for Automated Traceability
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Solution Overview
Problem
Current wafer production methods, whether using wire saws or laser irradiation, fail to efficiently track the history of wafers, leading to difficulties in identifying defect causes and are cumbersome for operators, increasing the risk of human errors.
Innovation Solution
A marking machine and wafer production system that reads and stores ingot information, using a laser beam to form separating layers and mark the wafer with production history, allowing for automated tracking without increasing operator man-hours.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If operator visually confirms and manually stores production history, then wafer history tracking is achieved, but operator workload increases and human errors occur
Solution Approach 1:
The system enables self-service automation where the marking machine automatically reads ingot information via the reading unit, stores it in the control unit's storage section, and marks the wafer with production history without requiring operator intervention. The system serves itself by automating the entire workflow from reading to marking.
Solution Approach 2:
The patent replaces the manual mechanical process of visual confirmation and physical data entry with an automated optical-electronic system. The reading unit optically reads ingot information, the control unit electronically processes and stores data, and the marking unit automatically transfers information to wafers, eliminating manual operator actions.
2Reliability
If manual tracking method is used, then wafer history can be recorded, but human errors increase and productivity decreases
Solution Approach 1:
The system implements automated feedback loops where the reading unit continuously reads ingot information, the control unit processes and validates data, and the marking unit applies verified information to wafers. This closed-loop automation ensures data accuracy while maintaining high production speeds without manual intervention.
Solution Approach 2:
The marking machine operates continuously by automatically reading ingot information, processing it through the control unit, and marking wafers in an unbroken workflow. This eliminates interruptions caused by manual data entry and ensures continuous production without compromising data reliability.
3Extent of automation
If automated marking is implemented, then operator workload is reduced, but system complexity increases
Solution Approach 1:
The patent merges multiple functions into a single integrated marking machine system: the reading unit for optical data capture, the control unit for data processing and storage, and the marking unit for information application are combined into one cohesive automated system, reducing overall system complexity despite high automation levels.
Solution Approach 2:
The marking machine is designed as a multi-functional universal system that can read various ingot information formats, store different types of production data, and mark different wafer types. This universality reduces the need for multiple specialized devices, thereby managing system complexity while maintaining high automation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient tracking of wafer history, reducing human errors and operator workload by automating the marking process, thereby improving productivity and defect analysis.
Implementation Method 1
a laser beam irradiation unit configured to form separating layers in the ingot by irradiating a laser beam of a wavelength which has transmissivity for the ingot, to the ingot with a focal point thereof positioned at a depth corresponding to a thickness of a wafer to be produced
Data Source
AI summary
Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.