Wafer-Level Metalens MTF Detection Without Assembly
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Solution Overview
Problem
Existing MTF detection devices cannot effectively detect individual metalenses on wafer-level metalens before dicing and assembling, leading to inefficiencies and increased costs due to the need for assembly and detection of conventional lenses.
Innovation Solution
A MTF detection device for wafer-level optical elements is developed, comprising a luminescent target, a mobile disc, an adjustable bracket, and a detection device, which allows for sequential and movable luminescent targets, adjustable positioning, and external processing assembly integration for detection without assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional MTF detection devices are used to detect wafer-level metalens, then the detection can only be performed after dicing and assembling individual metalenses, but this increases production time and cost
Solution Approach 1:
The patent divides the wafer-level metalens into individually detectable units by implementing a movable disc mechanism with multiple placing areas. Each placing area can position a specific metalens or group of metalenses for separate MTF detection, allowing the system to process individual elements without requiring complete dicing and assembly of all metalenses beforehand.
Solution Approach 2:
The patent enables preliminary detection of metalenses on the wafer before final dicing and assembly. By positioning the movable disc to place metalenses or metalens groups on the placing area for MTF detection in advance, the system identifies qualified metalenses early in the production process, avoiding unnecessary assembly of defective elements.
2Difficulty of detecting and measuring
If individual metalenses are detected before dicing, then detection capability is improved, but the detection device structure becomes more complex
Solution Approach 1:
The patent implements a universal detection platform that can detect both individual metalenses and groups of metalenses without requiring different detection systems. The movable disc with multiple placing areas and the adjustable bracket system provide multi-functionality, allowing the same device structure to handle various detection scenarios (individual or group detection) through reconfiguration rather than adding separate specialized equipment.
3Productivity
If wafer-level metalens detection is implemented without assembly, then production yield is improved, but positioning precision requirements increase
Solution Approach 1:
The patent introduces the movable disc as an intermediary component between the wafer-level metalens and the detection system. The disc provides a stable, controllable platform that facilitates precise positioning and movement of metalenses or metalens groups into the detection position. This intermediary mechanism enables accurate positioning without requiring direct manipulation of the delicate metalenses, thereby maintaining positioning precision while enabling detection before final assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables efficient detection of wafer-level optical elements, including metalenses, without the need for assembly, improving optical performance and production yield by allowing for precise detection and selection of individual metalenses before dicing.
Implementation Method 1
a luminescent target... the plurality of luminescent targets are used to emit light signals
Data Source
AI summary
A MTF detection device for wafer-lever optical elements is provided, the MTF detection device for a wafer-level optical element include a luminescent target, a mobile disc, an adjustable bracket, and a detection device. The plurality of luminescent targets are movable along the direction of the light path. The mobile disc is set up with a placing area and the mobile disc is movable, so as to locate different locations of the placing area on the extension of the central line of the luminescent target by moving the mobile disc. The distance between the adjustable bracket and the luminescent target is adjustable, and an external processing assembly is located on a first side of the adjustable bracket. The detection device is installed over the adjustable bracket, and is used to receive the light emitted from the luminescent target through the sample to be detected and the external processing assembly.