Wafer Scanning Nozzle Hood for Single-Chamber VPD Analysis
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Solution Overview
Problem
Traditional vapor phase decomposition (VPD) and scanning techniques for semiconductor wafers have limited throughput due to the need for separate chambers for decomposition and scanning, which increases processing time and exposes technicians to hazardous chemicals.
Innovation Solution
A system with a single chamber for both decomposition and scanning of semiconductor wafers, utilizing a nozzle with a hood that directs a stream of fluid along the wafer surface, allowing for efficient decomposition and scanning in a unified process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate chambers are used for decomposition and scanning, then each process can be performed independently, but processing time increases and technician exposure to hazardous chemicals increases
Solution Approach 1:
The patent combines the decomposition chamber and scanning chamber into a single integrated chamber. The nozzle assembly can switch between decomposition mode (introducing vapor phase decomposer) and scanning mode (directing fluid stream for scanning) within the same chamber space, eliminating the need for separate chambers and reducing processing time while maintaining process functionality
2Reliability
If separate chambers are used for decomposition and scanning, then each process can be optimized independently, but system complexity and exposure risk increase
Solution Approach 1:
The integrated chamber is designed as a multi-functional system that can perform both decomposition and scanning operations. The nozzle assembly serves dual purposes: introducing vapor phase decomposer during decomposition mode and directing fluid stream during scanning mode. This universal design reduces system complexity by eliminating redundant chamber structures while maintaining the ability to optimize each process independently through software control and mode switching
3Object-affected harmful factors
If separate chambers are used for decomposition and scanning, then safety isolation can be maintained, but throughput and efficiency decrease
Solution Approach 1:
By merging the decomposition and scanning functions into a single chamber, the system eliminates the need for physical chamber transitions and reduces the time wafers spend in processing. The integrated design maintains safety by using automated fluid handling and minimizing open exposure to hazardous chemicals, while significantly improving throughput by performing both operations in sequence within the same chamber without repositioning or transfer steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly reduces processing time and minimizes exposure to hazardous chemicals by integrating decomposition and scanning within a single chamber, enhancing both efficiency and safety.
Implementation Method 1
a nozzle hood extending from the nozzle body, the nozzle hood defining an inner channel longitudinally disposed along the nozzle body, the nozzle hood further defining one or more outer channels longitudinally disposed along the nozzle body
Implementation Method 2
ICP spectrometry employs electromagnetically generated partially ionized argon plasma which reaches a temperature of approximately 7,000K
Implementation Method 3
When a sample is introduced to the plasma, the high temperature causes sample atoms to become ionized or emit light
Implementation Method 4
a sample introduction system may transport an aliquot of sample to a nebulizer that converts the aliquot into a polydisperse aerosol suitable for ionization in plasma
Data Source
AI summary
Systems and methods are described for integrated decomposition and scanning of a material, such as a semiconducting wafer, a scanning nozzle includes, but is not limited to, a nozzle body defining one or more nozzle ports to receive fluid for introduction to the surface of the material and to recover fluid from the surface of the material, and a nozzle hood extending from the nozzle body, the nozzle hood defining an inner channel longitudinally disposed along the nozzle body, the nozzle hood further defining one or more outer channels longitudinally disposed along the nozzle body, the inner channel fluidically coupled with the one or more outer channels via one or more gaps defined by the nozzle hood.