Wafer-Level Optical Package Apertures Without Burrs or Adhesive Failure
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Solution Overview
Problem
Existing optical package manufacturing methods face challenges such as burrs from drilling, limited design flexibility, and reliability issues due to adhesion problems, leading to reduced manufacturing yield and increased costs.
Innovation Solution
A wafer-level manufacturing method using vacuum injection molding to form apertured substrates, which eliminates burrs and allows for complex shapes, increased design flexibility, and strong adhesion of optical elements without the need for adhesives, by jetting or molding transparent epoxy into apertures and curing it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If drilling holes in substrate to form apertures, then apertures can be formed to support optical elements, but burrs are created that interfere with assembly and reduce manufacturing yield
Solution Approach 1:
The patent replaces the mechanical drilling process with a chemical etching process using plasma or wet chemistry. This substitution eliminates the mechanical contact that generates burrs, producing clean aperture edges without the harmful artifacts associated with drilling operations.
Solution Approach 2:
The patent changes the fundamental parameter of aperture formation from mechanical removal (drilling) to chemical removal (etching). This parameter change transforms the process from one that creates burrs and debris to one that produces clean, precise aperture edges suitable for high-yield manufacturing.
2Ease of manufacture
If attaching optical element to substrate using adhesion methods, then optical element can be mounted, but risk of separation during device lifetime increases
Solution Approach 1:
The patent merges the optical element with the substrate by forming the aperture directly in the substrate material and filling it with optical adhesive. This integration creates a unified structure where the optical element becomes part of the substrate assembly, eliminating the risk of separation that plagues separately attached components.
Solution Approach 2:
The patent uses optical adhesive as an intermediary material that chemically bonds to both the substrate and the optical element. This intermediary creates a strong, reliable connection that prevents separation during the device lifetime while maintaining optical transparency.
3Reliability
If using substrate-based optical packages, then optical elements can be supported, but design flexibility is limited and lead-times increase for adjustments
Solution Approach 1:
The patent performs preliminary actions by forming apertures and integrating optical elements directly into the substrate during the substrate fabrication process itself, before final assembly. This preliminary integration allows for easier design modifications and adjustments without requiring separate attachment steps, thereby increasing design flexibility while maintaining package stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances manufacturing yield, reliability, and cost-effectiveness by eliminating burrs, improving adhesion, and allowing for more complex designs with shorter lead times, resulting in high-quality optical packages.
Implementation Method 1
forming an apertured substrate by a process of vacuum injection molding
Implementation Method 2
The step of curing the epoxy may comprise ultraviolet and/or thermal curing
Data Source
AI summary
A method of wafer-level manufacturing of an optical package (285) is disclosed. The method comprises forming an apertured substrate (170; 405) by a process of vacuum injection molding, each aperture (175A; 175B) in the apertured substrate configured to support an optical element (225; 420; 425). The method also comprises coupling the apertured substrate to a further substrate (255) comprising optical devices (260, 265) aligned with the apertures in the apertured substrate. Also disclosed is optical package (285, 600) formed according to the method and an apparatus, such as a smartphone, comprising the optical package.