Wafer Peeling Brush Cleaning to Prevent Swarf Contamination

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Solution Overview

Problem

The existing methods for peeling wafers from ingots using a peel-off layer as an interface risk contaminating the processing apparatus due to peeling swarf produced during the transfer of the wafer.

Innovation Solution

A peeling apparatus that includes an ingot holding unit, a wafer holding unit, and a cleaning brush capable of rotating about an axis perpendicular to the holding surfaces. The cleaning brush simultaneously cleans the peel-off surfaces of both the ingot and the wafer, effectively removing peeling swarf before the wafer is transferred.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a peel-off layer is used as an interface to peel off a wafer from an ingot, then manufacturing precision is improved, but apparatus contamination occurs due to peeling swarf

Engineering Contradiction:

Improvewafer peeling precisionVSAvoidapparatus contamination

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The cleaning brush performs preliminary cleaning action on the peel-off surfaces immediately after wafer peeling, removing peeling swarf before it can contaminate the apparatus. This preliminary action prevents contamination while maintaining the benefits of peel-off layer processing

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If peeling swarf is produced during wafer transfer, then manufacturing precision is improved, but loss of substance occurs due to swarf generation

Engineering Contradiction:

Improvewafer peeling precisionVSAvoidpeeling swarf loss

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

The cleaning brush converts the harmful peeling swarf into a removable substance by actively cleaning the surfaces, transforming the waste problem into a controlled removal process that prevents swarf accumulation and loss

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The peeling apparatus effectively prevents apparatus contamination by removing peeling swarf from the peel-off surfaces of both the ingot and the wafer, ensuring a cleaner processing environment.

Implementation Method 1

positioning a focused spot of a laser beam with a wavelength transmittable through the ingot to a depth corresponding to a thickness of the wafer to be produced

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

applying the laser beam to the ingot

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 3

a holding surface for holding under suction the wafer to be produced

Methodology Applied

Scientific EffectSuction: Suction

Data Source

PatentUS12296502B2Peeling apparatus

Publication Date: 2025.05.13 DISCO CORP

AI summary

There is provided a peeling apparatus including an ingot holding unit that has a holding surface for holding an ingot, a wafer holding unit that is capable of approaching and separating from the ingot holding unit and has a holding surface for holding under suction a wafer to be produced, and a cleaning brush that cleans peel-off surfaces at which the wafer to be produced has been peeled off from the ingot and thereby removes peeling swarf.