Wafer Pickup Position Tracking in Component Mounting
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Solution Overview
Problem
Existing mounting systems lack adequate information management to identify the pickup position of components on a wafer when defects are discovered in mounted components, making it difficult to investigate trends and relationships between pickup positions and defects.
Innovation Solution
An information management device and method that acquire and link pickup source information, mounting destination information, and defect result information, allowing identification of the pickup position on the wafer and analysis of defect causes, as well as outputting statistical information and instructions to prevent defect occurrences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If mounting systems only manage basic movement path information (pickup nozzle and mounting head), then device complexity is reduced, but the ability to investigate defect trends and relationships with pickup positions is insufficient
Solution Approach 1:
The system performs preliminary action by acquiring and storing pickup source information (including pickup position coordinates and wafer ID) at the time of component pickup, before mounting occurs. This allows the information to be readily available when defects are later detected, eliminating the need for complex retrospective tracking and enabling direct correlation between pickup positions and defect locations.
2Reliability
If the system memorizes detailed pickup source information and mounting destination information, then defect analysis capability is improved, but information management complexity increases
Solution Approach 1:
The information management system segments data into distinct components: pickup source information (wafer ID, pickup position coordinates, pickup nozzle ID) and mounting destination information (substrate ID, mounting position coordinates, mounting head ID). This segmentation allows for organized storage and efficient retrieval of specific information elements needed for defect analysis, reducing overall management complexity.
Solution Approach 2:
The system establishes feedback by creating linked relationships between pickup source information and mounting destination information through component identification. This linkage provides a feedback mechanism that enables traceability from final defect locations back to original pickup positions, allowing operators to identify patterns and investigate defect causes systematically.
Data Source
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AI summary
A management device that, when a component is mounted on a substrate, acquires pickup source information that includes pickup position information of the mounted component and mounting destination information that includes mounting position information of the mounted component and memorizes mounting result information that links both the above information on HDD 93. Thus, by referencing the mounting result information memorized on HDD 93 and obtaining the pickup source information from the mounting destination information of the mounted component, it is possible to identify the pickup position at the wafer from which the mounted component was picked up.