Wafer Polishing System Transfer Mechanism

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Solution Overview

Problem

The existing chemical mechanical planarization equipment lacks process flexibility and efficiency due to the heavy burden on the top transfer device, which results in increased transfer time and risk of impurities, and can lead to product defects if the top transfer unit fails.

Innovation Solution

A wafer polishing system with multiple transfer modes that utilize a wafer transfer channel and various transfer structures, including a delivery structure and a top transfer mechanism, allowing wafers to be transferred between polishing units and external stations along different trajectories without occupying additional space, enhancing flexibility and reducing the load on the top transfer device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If wafers are transferred solely through the top transfer device, then the transfer process is simplified, but the transfer time increases and the risk of impurities increases

Engineering Contradiction:

Improvetransfer device configurationVSAvoidwafer transfer time

Core Design Contradiction:

Device complexityVSLoss of time

Solution Approach 1:

The patent divides the wafer transfer function into multiple independent transfer devices: top transfer devices for vertical transfer and side transfer devices for horizontal transfer. This segmentation allows different transfer paths to operate simultaneously, reducing overall transfer time while maintaining system manageability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces side transfer devices that operate in the horizontal dimension, complementing the vertical operation of top transfer devices. This multi-dimensional transfer approach creates redundant paths, reducing dependency on a single transfer route and decreasing transfer time

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If the top transfer device works alone, then the system structure is simple, but the process flexibility is reduced

Engineering Contradiction:

Improvetransfer system structureVSAvoidprocess flexibility

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The transfer system is segmented into top transfer devices and side transfer devices with distinct functions. Top devices handle vertical transfers while side devices handle horizontal transfers between adjacent polishing units, enabling flexible routing options for different process requirements

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The side transfer devices are designed with universal capability to transfer wafers between any adjacent polishing units, while top transfer devices provide vertical transfer capability. This multi-functionality allows the system to adapt to various process configurations and requirements

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If multiple transfer devices are added, then process flexibility improves, but the space occupation increases

Engineering Contradiction:

Improvetransfer mode varietyVSAvoidequipment space

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The side transfer devices are integrated into the spaces between adjacent polishing units, merging the transfer function with the existing structural gaps. This combining approach adds transfer capability without requiring additional dedicated space

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The side transfer devices are positioned within the vertical space between the wafer surface and the polishing unit structure, nesting the transfer mechanism within existing spatial boundaries rather than expanding outward

Inventive Principle:

Principle #7Nested doll (Nesting)

4Device complexity

If the top transfer device bears heavy load, then the transfer function is concentrated, but the reliability decreases

Engineering Contradiction:

Improvetransfer device concentrationVSAvoidtransfer system stability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The heavy transfer load is segmented and distributed between top transfer devices and side transfer devices. Each device handles a portion of the total transfer volume, preventing any single device from becoming a bottleneck or failure point

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The side transfer devices serve as backup or alternative pathways, providing cushioning against potential failures of the top transfer devices. This redundancy ensures continuous operation even if one transfer device malfunctions

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS20250018527A1Wafer polishing system and wafer transfer method

Publication Date: 2025.01.16 HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD

AI summary

The invention discloses a wafer polishing system, which comprises polishing units. The polishing unit comprises a wafer transfer channel and polishing modules. The polishing module comprises a polishing platform and a polishing arm, and the polishing arm can drive wafers to move relative to the polishing platform. The wafer transfer channel is provided with at least two working positions, and a load port can move between the working positions. A delivery structure is arranged between adjacent polishing units, which transfers wafers between working positions of the adjacent polishing units along a first trajectory, and the first trajectory falls on the wafer transfer channel. The invention further discloses a wafer transfer method. The trajectories of this invention all fall within the wafer transfer channel, without occupying any additional space, thereby ensuring a reasonable layout. The process is flexible and highly efficient, and transfer stability is high.