Wafer Processing Head with Switchable Scrubbing Tapes
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Solution Overview
Problem
Conventional wafer processing methods require multiple tools and units for polishing and cleaning, leading to inefficiencies and incomplete surface processing, particularly due to the inability to effectively handle foreign matter on both surfaces of the wafer and the need for separate processing of the outermost regions.
Innovation Solution
A substrate processing apparatus with a single processing head that utilizes scrubbing tapes with abrasive grains for polishing and cleaning, along with position switching devices to switch between different tapes, and a hydrostatic support stage for efficient processing of both surfaces, ensuring complete coverage from the center to the outermost region of the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional substrate rotating mechanism with chucks and hollow motor is used to rotate the wafer, then the wafer can be held and rotated for polishing, but the outermost area of the wafer surface cannot be polished and requires a separate edge polishing unit
Solution Approach 1:
The invention combines the center polishing unit and edge polishing unit into a single integrated processing head. The processing head includes both a center polishing tool for the central region and an edge polishing tool for the outermost region, allowing both areas to be processed simultaneously or sequentially without requiring separate units or wafer transfers.
Solution Approach 2:
The processing head is designed as a multi-functional device that can perform both center polishing and edge polishing operations. The processing head can be configured with different polishing tools (center polishing tool and edge polishing tool) to handle different regions of the wafer surface, making it a universal processing unit that eliminates the need for multiple specialized units.
2Manufacturing precision
If the wafer is transferred between edge polishing unit and center polishing unit, then different regions can be processed, but particles in the air may adhere to the wafer during transfer
Solution Approach 1:
By integrating both center and edge polishing capabilities into a single processing head, the invention eliminates the need to transfer the wafer between separate units. The processing head remains stationary while the wafer is held and rotated by the substrate holding device, allowing continuous processing without exposure to airborne particles during transfer.
3Productivity
If multiple processing tools are provided in the processing head for rough polishing and finish polishing, then both processes can be performed, but it is necessary to replace the processing tools which takes time
Solution Approach 1:
The invention implements a dynamic tool selection mechanism where the processing head can switch between different polishing tools (rough polishing tool and finish polishing tool) without physical replacement. The position switching devices allow the system to dynamically select which tool contacts the wafer surface based on the required processing stage, eliminating tool replacement time while maintaining both rough and finish polishing capabilities.
4Manufacturing precision
If the processing head is divided into separate units for rough polishing and finish polishing, then each process can be optimized, but it is still necessary to transfer the substrate between units which takes time
Solution Approach 1:
The invention merges the rough polishing and finish polishing functions into a single processing head that contains both types of tools. The position switching devices enable the system to select and activate the appropriate tool within the same processing head, maintaining process optimization while eliminating substrate transfer time between separate units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient and complete processing of both surfaces of the wafer with reduced processing time, as the apparatus can perform different processes like polishing and cleaning with a single head, ensuring thorough removal of foreign matter and improved surface quality.
Implementation Method 1
hydrostatic support stage for efficient processing of both surfaces
Implementation Method 2
scrubbing tapes with abrasive grains for polishing and cleaning
Data Source
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AI summary
An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus according to the present invention includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.