Light-Absorbing Release Layer for Wafer Support Separation
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Solution Overview
Problem
Current semiconductor wafer processing techniques face challenges in achieving easy separation of semiconductor substrates from support substrates during polishing, with existing release methods being inefficient and leaving residues that are difficult to clean, and requiring high stress during polishing and low stress during removal.
Innovation Solution
A laminate structure comprising a semiconductor substrate, a light-transmissive support substrate, and an adhesive and release layer with a release agent composition that includes compounds with aromatic rings and a siloxane structure, allowing for easy release and subsequent cleaning by absorbing light and being soluble in cleaning agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a release layer with strong adhesive force is used to withstand polishing stress, then the semiconductor wafer remains stable during polishing, but the release layer becomes difficult to remove after polishing
Solution Approach 1:
The release layer is segmented into two distinct functional layers: an adhesive layer containing silane coupling agents that provides strong bonding to the semiconductor wafer during polishing, and a release layer containing aromatic rings that can be selectively removed after polishing. This segmentation allows each layer to optimize its specific function without compromising the other.
Solution Approach 2:
The chemical composition parameters of the release layer are specifically designed to change its properties at different stages: during polishing, the silane coupling agents provide strong adhesion; after polishing, the aromatic ring structures enable selective dissolution by changing the layer's chemical solubility characteristics, facilitating easy removal.
2Ease of operation
If existing release methods are used, then separation can be achieved, but residues remain that are difficult to clean
Solution Approach 1:
The release layer containing aromatic rings is designed to be selectively extracted or dissolved by specific cleaning agents after the separation process. This extraction principle allows the release layer to be completely removed without leaving residues on the semiconductor wafer, solving the cleaning problem while maintaining easy separation capabilities.
Solution Approach 2:
The aromatic ring structures in the release layer act as an intermediary substance that facilitates separation during polishing but can be subsequently removed by cleaning agents. This intermediary layer enables the separation function while being designed for complete removal, eliminating residues that would otherwise remain on the wafer surface.
3Force
If high stress is applied during polishing for strong adhesion, then the wafer remains stable, but the removal process requires excessive force that may damage the wafer
Solution Approach 1:
The mechanical removal process is replaced by a chemical dissolution process. Instead of applying excessive mechanical force to remove the release layer, specific cleaning agents chemically dissolve the aromatic ring-containing release layer, eliminating the need for high removal forces that could damage the semiconductor wafer while maintaining strong adhesion during polishing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient separation of semiconductor substrates from support substrates during processing, ensuring easy release and effective cleaning, while maintaining necessary stress levels during polishing and removal.
Implementation Method 1
the release layer absorbs light emitted from a side of the support substrate and then is used for release the semiconductor substrate and the support substrate
Data Source
AI summary
A laminate contains: a semiconductor substrate; a light-transmissive support substrate; and an adhesive layer and a release layer that are provided between the semiconductor substrate and the support substrate, in which the release layer absorbs light emitted from a side of the support substrate and then is used for release the semiconductor substrate and the support substrate, the release layer is a layer formed of a release agent composition, and the release agent composition contains a compound having: a first structure that is a structure for absorbing the light, contributes to easy release of the semiconductor substrate and the support substrate by absorbing the light, and has two or more aromatic rings constituting a n-electron conjugated system; and a siloxane structure as a second structure.