Wafer Transfer Robot Alignment Using Marker-Based Auto Teaching
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Solution Overview
Problem
Current wafer transfer robots in semiconductor processing systems require manual teaching operations to define positions of transfer structures and the robot itself, leading to potential deviations due to operator skill and increased manufacturing costs from separate teaching stations.
Innovation Solution
A wafer transfer apparatus equipped with a controller, a wafer transfer robot, and sensor units that recognize markers on transfer structures, allowing for automatic execution of teaching operations to determine position information and control the robot's movements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual teaching operation is used to specify positions of transfer structures and wafer transfer robot, then the teaching operation can be performed with simple equipment, but the accuracy of teaching operation deteriorates due to operator skill variation
Solution Approach 1:
The patent replaces manual mechanical teaching operations with an automated optical measurement system. A sensor unit equipped with a camera and laser distance meter automatically detects marker positions and calculates coordinate information, eliminating dependency on operator skill while improving teaching operation accuracy.
Solution Approach 2:
The system enables self-service teaching operation where the wafer transfer robot autonomously performs position specification. The robot uses its own sensor unit to detect markers and automatically calculate coordinate information, making the teaching process independent of external operators.
2Reliability
If a separate teaching station is provided to perform teaching operation, then the teaching operation can be performed systematically, but the manufacturing cost of wafer transfer apparatus increases
Solution Approach 1:
The patent merges the teaching station functionality directly into the wafer transfer robot by integrating a sensor unit (camera and laser distance meter) onto the robot itself. This eliminates the need for a separate teaching station while maintaining systematic teaching operation capability.
Solution Approach 2:
The sensor unit integrated on the wafer transfer robot serves multiple functions: it performs both teaching operations (position specification) and operational detection (wafer transfer positioning). This multi-functionality reduces overall system complexity while maintaining reliability.
3Productivity
If manual teaching operation is used, then the equipment cost is reduced, but the time taken for teaching operation varies depending on operator skill
Solution Approach 1:
The patent replaces manual teaching operations with automated optical detection and calculation. The sensor unit rapidly captures marker positions and the controller automatically calculates coordinate information, eliminating time variation caused by different operator skills and significantly improving teaching operation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise and consistent teaching operations independent of operator skill, reduces manufacturing costs by eliminating the need for separate teaching stations, and improves the accuracy and efficiency of semiconductor processing.
Implementation Method 1
a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers
Data Source
AI summary
A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.