Wafer-Scale Micro-Optical Replication via Segmented Master Hierarchy
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Solution Overview
Problem
Current methods for mass-producing micro-optical and micro-mechanical components face challenges in achieving wafer-scale replication due to the difficulty and cost of producing masters that cover large areas, as existing techniques like e-beam writing are limited to small areas, making it hard to bridge the gap between individual component size and wafer scale.
Innovation Solution
A method involving a generation process with multiple replication steps using a master tool, sub-masters, and replicas, where a recombination framework with troughs and channels on a substrate allows for the replication of structured elements in a lattice arrangement, enabling efficient wafer-scale replication by repeating the replication, hardening, and removal steps, and using filler material to control the z-dimension and planarity of the final replica.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If e-beam writing or similar techniques are used to create masters, then manufacturing precision is achieved, but the area coverage is limited to small regions only
Solution Approach 1:
The master creation process is segmented into multiple steps: first creating a small-area high-precision master, then using it to create sub-masters that cover larger areas, and finally combining multiple sub-masters into a full wafer-scale master. This segmentation allows each step to operate within its optimal range while achieving the ultimate goal of large-area coverage.
Solution Approach 2:
The patent implements a nested hierarchy where a small-area master contains the precise geometric features, which are then replicated into sub-masters that cover intermediate areas, which in turn are replicated into full wafer-scale masters. Each level nests the precision of the previous level while expanding the coverage area.
2Productivity
If a wafer-scale master is produced directly, then large-scale replication is enabled, but production cost increases significantly
Solution Approach 1:
Instead of directly creating an expensive wafer-scale master, the patent creates a small-area master and then uses replication processes to generate multiple sub-masters and eventually a full wafer-scale master. This copying approach reduces the cost of the original master while still achieving wafer-scale replication capability.
Solution Approach 2:
The patent performs preliminary replication steps to create intermediate sub-masters before producing the final wafer-scale master. This preliminary action breaks down the complex and costly direct wafer-scale master production into manageable stages, reducing overall production cost.
3Area of stationary object
If multiple replication steps are performed, then wafer-scale coverage is achieved, but process complexity increases
Solution Approach 1:
The replication process is segmented into distinct stages: first replication to create sub-masters from the original master, and second replication to create wafer-scale masters from sub-masters. Each stage uses standardized procedures, making the overall complex process manageable through modular segmentation.
4Reliability
If replication material is applied in thick layers, then complete coverage is ensured, but planarity and z-dimension control deteriorate
Solution Approach 1:
The replication process is divided into multiple sequential steps rather than attempting single-step thick-layer replication. Each step uses thinner material layers that can be properly controlled for planarity, while the cumulative effect achieves complete wafer-scale coverage.
Solution Approach 2:
The patent performs preliminary replication steps to create intermediate structures with good planarity. These intermediate structures then serve as templates for subsequent replication steps, ensuring that each layer maintains proper planarity while building up complete coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method supports large-scale, cost-effective wafer-scale replication with high profile fidelity and planarity, allowing for the production of multiple identical micro-optical components with precise dimensions and stability, suitable for industrial production, and is applicable to various replication processes including UV-embossing.
Implementation Method 1
replicating a structured surface of an element to be replicated (for example the master or sub-master or a cast) into the liquid or viscous or plastically deformable material
Implementation Method 2
hardening the liquid or viscous or plastically deformable material to form a structured surface of a replicated element
Implementation Method 3
In the case of micro-optics, the surface topology can be a refractive or a diffractive structure, or a combination of both. For that purpose, a tool (negative copy) is prepared from the master, which is then used to UV-emboss the epoxy resin.
Data Source
AI summary
The invention concerns a process of manufacturing optical components. A replication tool, a sub-master or a replica is manufactured using a structured element (for example a master) and a substrate. A structure of the structured element is replicated into liquid or plastically deformable material disposed at a first place on said substrate, then hardened to make it dimensionally stable, whereon the structured element is removed. These replicating, hardening and removing steps are repeated for a second, third, etc. place on said substrate the same structured element.