Wafer-Scale Optical I/O Modules for Data Processors
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Solution Overview
Problem
The increasing input/output capacities of electronic processing chips exceed the electrical signal handling capabilities within the limited size of a practical electronic chip package, necessitating a more efficient data transmission method.
Innovation Solution
A system featuring a first optical input/output module with a two-dimensional array of photonic integrated circuits, electronic integrated circuits, and data processors that convert optical signals to electrical signals and vice versa, supporting high-throughput data transmission through optical links.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical signals are used for data transmission within electronic chip packages, then the system structure remains simple and manageable, but the input/output capacity becomes insufficient as data processing demands increase
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission using photonic integrated circuits. This substitution enables significantly higher input/output capacity (reaching terabits per second) while overcoming the fundamental bandwidth limitations of electrical interconnects within chip packages, directly resolving the productivity vs. device complexity contradiction.
Solution Approach 2:
The patent changes the fundamental transmission medium parameter from electrical conductors to optical waveguides and photonic components. This parameter change enables higher data rates and greater I/O capacity while maintaining a manageable system structure through integration of photonic circuits directly onto the chip package.
2Productivity
If optical fibers are used to transmit optical signals between data processing servers, then high data throughput is achieved, but the system requires complex optical-to-electrical conversion processes
Solution Approach 1:
The patent replaces the traditional optical-to-electrical conversion process with direct optical signal processing using photonic integrated circuits. This substitution eliminates complex electronic conversion stages while maintaining high data throughput, as the photonic circuits can process optical signals directly without requiring conversion to electrical domain.
Solution Approach 2:
The photonic integrated circuits perform multiple functions including optical signal reception, processing, and transmission within a single integrated component. This multi-functionality reduces the overall system complexity by consolidating what would otherwise require separate optical receivers, processors, and transmitters into a unified photonic platform.
3Productivity
If more photonic integrated circuits are arranged in a two-dimensional pattern, then the data transmission capacity increases, but the chip package area required increases
Solution Approach 1:
The patent transitions from traditional one-dimensional linear arrangements of I/O components to two-dimensional patterned arrays of photonic integrated circuits. This dimensional change allows for significantly higher density packing of optical components, enabling increased data transmission capacity without a proportional increase in chip package area.
Solution Approach 2:
The patent merges multiple photonic integrated circuits into a closely integrated two-dimensional array where components share common infrastructure such as waveguides, coupling structures, and control logic. This merging approach maximizes space utilization and enables high transmission capacity within a compact footprint by eliminating redundant elements and optimizing spatial arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-capacity data throughput, specifically supporting up to 200 Tbps aggregate data throughput, while maintaining low power consumption and flexible network configurations, and efficiently managing heat generated by data processing components.
Implementation Method 1
Each of at least some of the photonic integrated circuits is configured to receive first optical signals and generate first electrical signals based on the first optical signals
Implementation Method 2
each of at least some of the photonic integrated circuits is configured to receive second electrical signals and generate second optical signals based on the second electrical signals
Data Source
AI summary
A system includes a wafer-scale processing module that has an array of data processors. Optical input/output modules are provided near edges of the wafer-scale processing module. Each optical input/output module includes an array of photonic integrated circuits that convert optical signals received from optical links to electrical signals that are transmitted to the data processors, and convert electrical signals received from the data processors to optical signals that are output to the optical links.