Wafer Scale Transceiver Assembly via Silicon Interposer
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Solution Overview
Problem
The existing methods for assembling optical transceiver modules are time-consuming and expensive due to the need for active optical alignment of separate components, which becomes inefficient as demand increases.
Innovation Solution
A wafer scale implementation using a silicon wafer as an optical reference plane and platform for assembling multiple transceiver modules, allowing for simultaneous integration and precise alignment of optical and electronic components through through-silicon vias and wafer scale wirebonding, with passive and active alignment techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual unit assembly approach is used for transceiver modules, then precise optical alignment can be achieved through active optical alignment, but the assembly process becomes expensive and time-consuming
Solution Approach 1:
Multiple transceiver modules are assembled simultaneously on a single silicon wafer platform rather than individually. The wafer-scale assembly process integrates multiple modules in parallel, achieving both precise optical alignment through the wafer's reference plane and high productivity through simultaneous processing of all modules.
Solution Approach 2:
The silicon wafer serves as a universal platform that provides optical reference plane, mechanical support, and electrical interconnections for multiple transceiver modules simultaneously. This multi-functional approach eliminates the need for separate assembly processes for each module while maintaining alignment precision.
2Reliability
If individual unit assembly approach is used for transceiver modules, then active optical alignment ensures signal path integrity, but the process becomes problematic for meeting increasing demand
Solution Approach 1:
The patent combines multiple transceiver modules into a single wafer-scale assembly, maintaining signal path integrity through the precise optical reference plane of the silicon wafer while achieving high throughput through parallel assembly of all modules simultaneously.
Solution Approach 2:
The silicon wafer is pre-prepared with precise optical reference planes, lithographically-defined openings, and through-silicon vias before module assembly. This preliminary preparation ensures that when modules are assembled, the optical alignment and electrical connections are already optimized, maintaining signal integrity while speeding up the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the efficiency of transceiver module assembly while maintaining precise optical alignment, enabling mass production of transceiver modules with reduced costs and time.
Implementation Method 1
a silicon interposer wafer for use as a platform for assembling a plurality of separate transceiver modules, the silicon interposer wafer defined as comprising a planar top surface defining an optical reference plane
Implementation Method 2
a plurality of conductive vias formed therethrough to provide electrical connections to other components
Implementation Method 3
Wafer scale wirebonding techniques are used to create the necessary electrical connections between the individual elements
Implementation Method 4
Optical components such as lasers, isolators, lenses (individual and arrays), photodiodes and the like are placed within lithographically-defined openings on the interposer, where the ability accurately and precisely define the location and size of openings using conventional CMOS fabrication techniques
Data Source
AI summary
A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.