Wafer Stack Sunshade Plate Stray Light Suppression
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Solution Overview
Problem
Existing camera module manufacturing processes are inefficient due to the time-consuming and complex step of attaching separate baffles to each camera module after manufacturing, which can lead to damage and contamination of the optical system, and do not effectively suppress stray light entering at high angles, resulting in reduced image quality.
Innovation Solution
A sunshade plate with through holes aligned to the main optical axes is integrated into the wafer stack during the manufacturing process, allowing for the creation of a complete integrated optical device module with a built-in sunshade that defines the field of view, eliminating the need for additional baffle attachment and providing a protective cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate baffles are attached to each camera module after manufacturing, then the field of view can be defined and stray light can be suppressed, but the manufacturing process becomes time-consuming and complex
Solution Approach 1:
The baffle structure is merged with the wafer stack by integrating it into the same substrate. The baffle is formed as part of the wafer structure itself, eliminating the need for separate attachment steps. This combines what were previously separate components (baffle and camera module) into a single integrated unit, resolving the contradiction between stray light suppression and manufacturing complexity.
Solution Approach 2:
The baffle structure is prepared and integrated into the wafer stack during the initial manufacturing process rather than being attached later. By performing the baffle integration preliminarily during wafer fabrication, the manufacturing process becomes more efficient while maintaining effective stray light suppression.
2Reliability
If separate baffles are attached to each camera module after manufacturing, then the field of view can be defined, but the optical system is exposed to damage and contamination
Solution Approach 1:
The baffle is merged with the wafer stack structure, creating a protected integrated unit. This integration shields the optical system from external contamination and damage that would occur during separate baffle attachment, while still maintaining the field of view definition function.
Solution Approach 2:
The baffle structure is incorporated into the wafer stack before the dicing and assembly processes. This preliminary integration provides protective cushioning for the optical system, preventing exposure to harmful factors during subsequent manufacturing steps.
3Productivity
If a sunshade plate is integrated into the wafer stack, then manufacturing complexity is reduced and mass production is enabled, but additional integration steps are required
Solution Approach 1:
The sunshade plate is merged with the wafer stack by forming it as part of the same substrate structure. This integration eliminates the need for separate attachment steps for each individual module, enabling mass production through wafer-level processing while the integration is achieved through standard semiconductor manufacturing techniques.
Solution Approach 2:
The sunshade plate structure is replicated across the entire wafer surface in a single manufacturing step. This copying approach allows hundreds of identical baffle structures to be created simultaneously, enabling mass production while actually reducing the number of integration steps compared to individual attachment.
4Productivity
If the wafer stack is diced into individual devices, then separate camera modules can be produced, but the integrated sunshade structure must be maintained
Solution Approach 1:
The sunshade plate is merged with the wafer stack substrate, creating a unified structure that is diced together with the camera modules. This merging ensures that when the wafer is diced into individual modules, the sunshade structure remains precisely aligned with each module without requiring separate alignment steps, thus maintaining manufacturing precision while enabling individual module production.
Data Source
AI summary
In a method for fabricating an integrated optical device by creating a wafer stack by stacking at least a top wafer carrying as functional elements a plurality of lenses on at least one further wafer including further functional elements, and separating the wafer stack into a plurality of integrated optical devices, wherein corresponding functional elements of the top and further wafer are aligned with each other and define a plurality of main optical axes, a method for providing a sunshade plate as part of an integrated optical device (10), including the steps of: providing a sunshade plate having a plurality of through holes, the through holes being arranged to correspond to the arrangement of the functional elements on the top wafer; and stacking the sunshade plate on the top wafer, with the through holes being aligned with said main optical axes.