Wafer Stage Compensation for Robot Positioning Errors

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Solution Overview

Problem

Existing semiconductor treating devices face challenges in maintaining high-accuracy wafer transport due to positioning errors by the transport robot, particularly when transitioning from a preliminary exhaust chamber to a sample stage, which cannot be corrected by existing methods.

Innovation Solution

A method is introduced to calculate and correct transport errors by measuring the position deviation of the transport mechanism using sensors, adjusting the sample stage to compensate for these errors, ensuring accurate placement of wafers on the sample stage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If a transport robot is used to transport wafers from a preliminary exhaust chamber to a sample stage, then automation and productivity are improved, but positioning errors occur that cannot be corrected, causing transport accuracy to deteriorate

Engineering Contradiction:
Improveautomation of wafer transportVSAvoidtransport accuracy
Core Design Contradiction:
Extent of automationVSManufacturing precision

Solution Approach 1:

The system measures the actual position of the transport mechanism using sensors, calculates the position deviation from the ideal position, and feeds this information back to control the sample stage. This closed-loop feedback mechanism enables real-time correction of positioning errors, resolving the contradiction between automated transport and transport accuracy.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system dynamically changes the position parameter of the sample stage based on the measured deviation. By adjusting the sample stage position according to the calculated error, the system compensates for transport robot positioning errors and maintains high transport accuracy throughout automated operation.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the sample stage is adjusted to correct transport errors, then transport accuracy is improved, but additional control mechanisms and complexity are introduced

Engineering Contradiction:
Improvesample placement accuracyVSAvoidcontrol system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system uses the existing sample stage's positioning capability to correct transport errors, making the system self-correcting without requiring additional active correction mechanisms. The sample stage serves dual purposes: its primary function and error correction, thereby improving accuracy while minimizing added complexity.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS20250323080A1Semiconductor Treating Device
Publication Date: 2025.10.16 HITACHI HIGH TECH CORP
  • US20250323080A1 patent drawing
  • US20250323080A1 patent drawing
  • US20250323080A1 patent drawing

AI summary

In a semiconductor treating device according to the disclosure, before a transport mechanism places a sample onto a sample stage, a position deviation amount from an ideal position of the sample is calculated using an angle or a position of the transport mechanism measured by a sensor, and the sample stage is operated by the position deviation amount.