Wafer Testing Device Local Temperature Control via Segmented Cooling
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Solution Overview
Problem
Existing testing devices for electronic devices on semiconductor wafers face challenges in controlling temperature locally, leading to thermal loads on adjacent devices during inspection, which can result in decreased yield and increased costs due to inability to detect issues under implementation voltage until packaging.
Innovation Solution
A testing device with a mounting table featuring a coolant flow path and a light irradiation mechanism, where LEDs control heat absorption and heating based on measured temperature, allowing for precise temperature control of the electronic device under inspection while cooling adjacent devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a coolant flow path and heater are installed in the mounting table to control the temperature of the wafer as a whole, then the temperature control capability is improved, but the ability to locally control the temperature of the electronic device under inspection deteriorates
Solution Approach 1:
The patent divides the mounting table into multiple independent heating/cooling regions, each with its own heater and coolant flow path. This segmentation allows different areas of the mounting table to be controlled independently, enabling local temperature control of the electronic device under inspection without affecting the entire wafer
Solution Approach 2:
The patent applies heating and cooling functions to specific local areas rather than uniformly across the entire mounting table. By positioning heaters and coolant flow paths only in necessary regions, the system achieves local temperature control while reducing overall system complexity
2Object-affected harmful factors
If the voltage applied to the electronic device under inspection is lowered to suppress thermal load on adjacent devices, then thermal load suppression is improved, but the ability to detect problems under implementation voltage deteriorates
Solution Approach 1:
The patent segments the thermal control function from the voltage application function. By using localized heating/cooling regions, the system can apply full implementation voltage to the device under inspection while independently controlling the temperature of surrounding areas, thus detecting problems under actual operating conditions without thermally affecting adjacent devices
Solution Approach 2:
The patent introduces localized heating/cooling regions as intermediary elements between the electronic device under inspection and adjacent devices. These intermediaries actively manage thermal transfer, allowing high voltage application without propagating thermal load to neighboring devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature control of the electronic device under inspection, preventing thermal loads on adjacent devices, allowing for timely detection of issues under implementation voltage, thus reducing package yield loss and costs.
Implementation Method 1
a mounting table (30) including a coolant flow path (32a) through which a coolant capable of transmitting light flows
Implementation Method 2
a light irradiation mechanism having LEDs disposed to face a surface on the side opposite the placement side of the inspection object of the mounting table
Implementation Method 3
controlling the heat absorption by the coolant and heating by light from the LEDs
Data Source
AI summary
A testing device for inspecting an electronic device by causing contact terminals to electrically contact the electronic device, includes: a mounting table formed with a light transmission member opposite the side on which a inspection object is placed and having therein a coolant flow path through which a coolant capable of transmitting light flows; a light irradiation mechanism disposed so as to face the surface opposite the inspection object placement side of the mounting table, and having LEDs pointing toward the inspection object; and a controller controlling absorption of heat by the coolant and heating by the lights from the LEDs to control the temperature of the electronic device to be inspected. The controller controls the light output from the LEDs based on the measured temperature of the electronic device to be inspected and controls the absorption of heat by the coolant based on the LED light output.