Semiconductor Wafer Thinning and Singulation on Pliable Carrier
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Solution Overview
Problem
The existing methods for thinning and singulation of semiconductor wafers require multiple transfers and flips, increasing process time and error risk, and consuming additional resources due to the need for frequent handling and different consumables.
Innovation Solution
A method where a semiconductor substrate is mounted face down on a carrier with a pliable material, allowing for backside grinding and subsequent dicing while remaining on the carrier, followed by stretching the pliable material to separate singulated dice before picking, reducing the need for multiple transfers and flips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple transfers and flips are performed during wafer thinning and singulation, then the wafer can be processed on different devices, but the process time increases and error risk is introduced
Solution Approach 1:
The patent combines multiple processing operations (thinning, singulation, and die separation) into a single continuous process performed on one carrier. The carrier is designed to accommodate the entire workflow without requiring transfers or flips, merging what were previously separate device-based operations into an integrated system.
Solution Approach 2:
The carrier is prepared in advance with specific features (pliable material, stretching capability) that enable subsequent processing steps to be performed without transfers. The preliminary design of the carrier structure allows the wafer to be processed face-down throughout, eliminating the need for flipping that would otherwise be required.
2Adaptability or versatility
If multiple transfers and flips are performed during wafer thinning and singulation, then different devices can be utilized, but the risk of error increases
Solution Approach 1:
The patent combines multiple processing operations (thinning, singulation, and die separation) into a single continuous process performed on one carrier. The carrier is designed to accommodate the entire workflow without requiring transfers or flips, merging what were previously separate device-based operations into an integrated system.
3Ease of manufacture
If multiple consumables are used during flipping and transfer, then the processing can be completed, but the expense and resource consumption increase
Solution Approach 1:
The patent extracts and eliminates the need for multiple consumables associated with flipping and transferring operations. By performing all processing on a single carrier without flips, the consumables that would be required for each transfer and flip operation are removed from the process.
Solution Approach 2:
The carrier is designed to perform multiple functions (support, thinning, singulation, and die separation) without requiring external consumables for each operation. The pliable material and stretching mechanism are integral to the carrier itself, eliminating the need for additional consumable materials that would otherwise be required for transfers and flips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes wafer handling, reduces process time, and decreases the risk of errors by allowing for efficient thinning and singulation on a single carrier, thereby streamlining the semiconductor wafer processing.
Implementation Method 1
The pliable material may be stretched to spread singulated die from one another prior to the picking of the singulated die from the carrier
Implementation Method 2
back side grinding
Data Source
AI summary
Some embodiments include methods in which a front side region of a semiconductor substrate is placed against a surface. While the front side region is against the surface, the semiconductor substrate is thinned, and then cut into a plurality of dice. The surface may be a pliable material, and may be stretched after the cutting to increase separation between at least some of the dice. While the pliable surface is stretched, at least some of the dice may be picked from the surface. In some embodiments, the semiconductor substrate is retained to the surface with a radiation-curable material. The material is in an uncured and tacky form during the thinning of the substrate, and is subsequently cured into a less tacky form prior to the picking of dice from the surface.