Wafer Transfer Device Dynamic Grip for Groove Alignment
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Solution Overview
Problem
Existing wafer transfer devices face challenges in stably holding wafers with vertical posture due to processing accuracy errors, leading to potential contamination from particles generated during transfer, as the wafer may strongly contact the inner wall or experience excessive friction when aligned incorrectly.
Innovation Solution
A wafer transfer method and device that holds the wafer at three support points during transfer, allowing it to adjust and absorb positioning errors, preventing strong contact with the inner wall by moving the wafer into the groove while supported at two points, thus minimizing friction and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the wafer is held firmly at multiple points to ensure stable transfer, then the stability of wafer holding is improved, but the ability to absorb positioning errors is reduced
Solution Approach 1:
The holding hand transitions from a static firm grip to a dynamic controlled release. During transfer, the wafer is held firmly at multiple points for stability. Upon reaching the target groove, the holding force is dynamically adjusted to allow the wafer to self-align and absorb positioning errors through slight movements, resolving the contradiction between stable holding and positioning accuracy.
Solution Approach 2:
The system performs preliminary positioning by bringing the wafer close to the target groove while still held, then releases the holding force to allow final self-alignment. This preliminary action separates the stable transfer phase from the precision positioning phase, enabling both firm holding during transport and error absorption during placement.
2Reliability
If the wafer is restricted tightly to prevent movement during transfer, then the stability of transfer is improved, but particle generation increases due to strong contact with inner walls
Solution Approach 1:
The holding hand dynamically adjusts its grip: maintaining firm restriction during transfer for stability, then releasing upon reaching the groove to allow the wafer to settle naturally without strong contact with inner walls. This dynamic adjustment prevents particle generation while maintaining transfer stability.
Solution Approach 2:
The system prepares for potential positioning errors by designing the holding mechanism to transition from a restricted state to a more compliant state near the target. This beforehand cushioning allows the wafer to absorb positioning errors through controlled movement rather than forced contact, preventing particle generation.
3Measurement precision
If the holding hand maintains constant contact with the wafer during transfer, then the control precision is improved, but friction and particle generation increase
Solution Approach 1:
The holding hand implements dynamic contact: maintaining constant contact during transfer for control precision, then reducing contact pressure or releasing at the target groove to minimize friction and particle generation. This dynamic approach balances control precision with harm reduction.
Solution Approach 2:
The system performs preliminary transfer with constant contact for precision control, then executes a final release action at the groove to allow friction-free settling. This separation of control phase and placement phase reduces overall friction and particle generation while maintaining control precision during the critical transfer portion.
Data Source
AI summary
A wafer transfer method which transfers a wafer with a disc shape to a groove for vertically placing the wafer therein, by use of a wafer holding hand, includes causing the wafer holding hand to hold the wafer at at least three support points on an edge of the wafer; moving the wafer holding hand holding the wafer to cause the wafer with a vertical posture in which the wafer is vertically oriented to be positioned above the groove for vertically placing the wafer therein; causing the wafer holding hand to cease to hold the wafer and to support the wafer at two support points on the wedge of the wafer; and moving the wafer holding hand supporting the wafer downward until the edge of the wafer moves into the groove for vertically placing the wafer therein.