Wafer Transfer Device Flexible Suction for Warped Wafers
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Solution Overview
Problem
Conventional wafer transferring devices struggle to stably transfer warped wafers due to the increased likelihood of warping, which prevents stable vacuum suction and affects transportation stability as the warped wafers may not contact vacuum nozzles evenly.
Innovation Solution
A wafer transferring device with a supporting carrier featuring a single vacuum suction port and a flexible member that can deform to accommodate the warped shape of the wafer, ensuring stable suction and transfer by maintaining a consistent vacuum degree and supporting the wafer's central and peripheral regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vacuum suction nozzles are used to transfer the wafer, then the suction force is distributed and the wafer can be held stably, but the warped wafer cannot contact all nozzles simultaneously, reducing transfer stability
Solution Approach 1:
The patent divides the single suction force into multiple vacuum suction nozzles arranged in different regions (central region, first peripheral region, second peripheral region). Each nozzle independently contacts different parts of the warped wafer, ensuring that the entire wafer surface is engaged for stable transfer despite the warping.
Solution Approach 2:
The patent applies different suction forces to different regions of the wafer by positioning vacuum suction nozzles in specific locations. The central region, first peripheral region, and second peripheral region each receive appropriate suction force to accommodate the warped shape, with each nozzle optimized for its local contact point.
2Manufacturing precision
If the wafer thickness is reduced to meet manufacturing requirements, then the wafer quality improves, but the wafer becomes more prone to warping, making it difficult to maintain stable contact with vacuum nozzles
Solution Approach 1:
The patent transitions from a single-point or single-plane contact approach to a multi-dimensional contact system with vacuum suction nozzles distributed across central and peripheral regions. This spatial distribution in multiple dimensions allows the system to accommodate the warped shape without requiring thicker wafers.
Solution Approach 2:
The patent creates a universal transfer mechanism that can handle both flat and warped wafers of reduced thickness. The multi-region vacuum suction system serves multiple functions: it provides stable suction for flat wafers while simultaneously adapting to contact warped surfaces, making the transfer device universally applicable to thin wafers regardless of their flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively stabilizes the transfer of warped wafers by maintaining a consistent vacuum and supporting the wafer's shape, allowing for reliable handling across various warping degrees and temperature conditions, reducing production costs and increasing applicability.
Implementation Method 1
The single vacuum suction port is adapted to suck a first central region of the first wafer so as to lift up and transfer the first wafer
Data Source
AI summary
A wafer transferring device adapted to suck and transfer a first wafer is provided. The wafer transferring device includes an arm and a supporting carrier. The supporting carrier is connected to the arm. The supporting carrier has a single vacuum suction port exposed to an upper surface of the supporting carrier. The supporting carrier is adapted to move to a position below the first wafer. The single vacuum suction port is adapted to suck a first central region of the first wafer so as to lift up and transfer the first wafer.