Wafer Tape Transfer Using Spaced Ring Frames
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Solution Overview
Problem
The existing wafer transfer methods risk damaging or contaminating wafers during the adhesive tape replacement process, as cutting tools may contact the wafer and cutting waste can adhere to it, leading to significant losses due to the need for cutting the first adhesive tape.
Innovation Solution
A method and apparatus that transfer a wafer from a first adhesive tape to a second adhesive tape without cutting the first adhesive tape, using a ring frame disposing step to superpose the second ring frame on the first ring frame without contact, affixing the second adhesive tape to the wafer, and peeling off the first adhesive tape using a peeling step, all while maintaining a predetermined interval between the ring frames to prevent adhesion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the adhesive tape is cut during the transfer process, then the wafer can be transferred from the first adhesive tape to the second adhesive tape, but the wafer may be damaged or contaminated by the cutting tool and cutting waste
Solution Approach 1:
The transfer process is divided into three independent stages: (1) cutting the first adhesive tape to release the wafer from the first ring frame, (2) affixing the second adhesive tape to the wafer, and (3) peeling off the first adhesive tape from the wafer. This segmentation allows each operation to be performed optimally without compromising the wafer, as the wafer is handled separately in each stage rather than requiring simultaneous complex operations.
Solution Approach 2:
The second adhesive tape is prepared and positioned on the second ring frame before the wafer transfer operation begins. The second ring frame is pre-positioned to face the first ring frame in superposition. This preliminary preparation ensures that when the wafer is released from the first adhesive tape, it can be immediately and securely affixed to the second adhesive tape without exposure or risk of damage.
2Ease of operation
If the first adhesive tape is cut to enable wafer transfer, then the transfer process can be completed, but cutting waste may adhere to the wafer and contaminate it
Solution Approach 1:
The cutting operation is separated in time and space from the wafer handling operations. The first adhesive tape is cut while the wafer is still secured to the first ring frame, and the cutting waste falls away from the wafer. Subsequently, the wafer is transferred to the second adhesive tape in a clean environment free from cutting waste contamination.
Solution Approach 2:
The cutting operation is extracted as a separate, independent step performed on the first adhesive tape alone, not involving the wafer or second adhesive tape. This extraction ensures that cutting waste is generated only during the tape cutting phase and does not come into contact with the wafer during the transfer process.
3Device complexity
If the second ring frame is placed in contact with the first ring frame during superposition, then the alignment can be simplified, but the cutting tool may come into contact with the wafer and damage it
Solution Approach 1:
The space between the first and second ring frames serves as an intermediary zone where the cutting tool operates. By maintaining a controlled gap between the ring frames during superposition, the cutting tool can access the first adhesive tape for cutting without risking contact with the wafer, which is positioned centrally between the ring frames. This intermediary space protects the wafer while enabling the necessary cutting operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for safe and contamination-free wafer transfer by avoiding contact between the cutting tool and wafer and preventing cutting waste from adhering, thus minimizing losses and ensuring the wafer is not damaged during the adhesive tape replacement process.
Implementation Method 1
a first adhesive tape affixed to a first ring frame in such a manner as to close a first opening portion... a wafer affixed to the first adhesive tape
Data Source
AI summary
A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is not affixed to the first adhesive tape, holding the wafer by the second ring frame via the second adhesive tape, and peeling off the first adhesive tape from the wafer.