Wafer Transfer Robot Vacuum Zone Control

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Solution Overview

Problem

Wafer transfer robots in semiconductor fabrication facilities face challenges in achieving fast and secure transfer of wafers without risking damage, as existing technologies struggle to accurately monitor and control vacuum levels for secure wafer handling.

Innovation Solution

The implementation of a wafer transfer robot system that uses vacuum sensors and a vacuum line with variable control to monitor and adjust vacuum levels, allowing for precise determination of wafer engagement and secure transfer by transitioning through defined vacuum zones, enabling secure and efficient wafer handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vacuum level is increased to secure wafer transfer, then wafer holding security is improved, but risk of wafer damage increases

Engineering Contradiction:
Improvewafer holding securityVSAvoidwafer damage risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system divides vacuum levels into multiple zones (first vacuum zone with lower vacuum level for safe holding, second vacuum zone with higher vacuum level for secure transfer) and transitions between them based on operational phase. This parameter change approach allows the system to optimize vacuum level dynamically - using lower vacuum during positioning to prevent damage, and higher vacuum during transfer to ensure security, thereby resolving the contradiction between holding security and damage risk

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The vacuum level is made dynamic rather than static, with the system automatically transitioning between different vacuum zones based on the operational state. The controller adjusts vacuum level in real-time - maintaining lower vacuum during wafer approach and positioning, then increasing to higher vacuum during secure transfer phase. This dynamic adaptation allows the system to achieve both safe holding and secure transfer at different times in the process

Inventive Principle:
Principle #15Dynamics

2Measurement precision

If vacuum monitoring precision is improved to determine wafer engagement, then transfer security is improved, but system complexity increases

Engineering Contradiction:
Improvevacuum level monitoring precisionVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The system uses a vacuum sensor to precisely monitor vacuum level and divides the monitoring range into distinct zones with threshold values. By establishing clear vacuum level thresholds that define different operational zones, the system achieves precise wafer engagement detection through simple threshold comparison rather than complex analysis, maintaining measurement precision while controlling system complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The vacuum monitoring range is segmented into multiple discrete zones (first vacuum zone and second vacuum zone) with defined boundaries. This segmentation allows the controller to determine wafer engagement by detecting which zone the current vacuum level falls into, using simple zone-based logic rather than continuous complex analysis, thereby achieving precise monitoring with manageable system complexity

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures secure and efficient wafer transfer by accurately determining when a wafer is held securely, allowing for maximum speed and acceleration, while preventing damage by detecting potential issues and adjusting operations accordingly.

Implementation Method 1

monitoring a vacuum level in a vacuum line coupled to the vacuum source and the end effector

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

a vacuum line coupled to the end effector and a vacuum source. The robot includes a node including a processor and a memory storing instructions executable by the processor to perform a wafer transfer method

Methodology Applied
Scientific EffectVacuum pressure: Vacuum

Data Source

PatentUS11712809B2Robot vacuum control and monitoring system
Publication Date: 2023.08.01 WAFERPATH INC
  • US11712809B2 patent drawing
  • US11712809B2 patent drawing
  • US11712809B2 patent drawing

AI summary

A method of operating a robot including a vacuum port for engaging an item, e.g. a wafer, is disclosed. The method includes operating, by a computer system, the robot in a first state, detecting using a vacuum sensor, a transition of a vacuum parameter from a first vacuum parameter zone to a second parameter zone in a plurality of vacuum parameter zones. Based on detecting the transition of the vacuum parameter from the first vacuum parameter zone to the second vacuum parameter zone, the operating state of the robot is altered from the first state to a second state. Also disclosed is an item transfer robot as part of an item transfer system.