Wafer Transport Vacuum Chamber Alignment Device

Solution Overview

Problem

In semiconductor processing systems, frame assemblies with varying diameters often become translationally or rotationally offset during transfer, leading to misalignment issues when returning to loading ports, which existing alignment methods struggle to address efficiently under vacuum conditions while minimizing tool footprint and cost.

Innovation Solution

A transport vacuum chamber with an alignment device featuring guide members that adjust from an expanded to a contracted configuration to precisely align frame assemblies translational and rotationally, using a positioning assembly and actuating mechanism to engage with the frame assembly and adjust its position within a tolerance of ±1 mm and ±1°, allowing accurate transfer between modules and load locks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a slow spinning table and optics are used to determine frame assembly position, then alignment precision is improved, but device complexity and tool footprint increase

Engineering Contradiction:

Improvealignment precisionVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical slow spinning table and optical measurement system with a purely mechanical alignment device comprising guide members that physically guide the frame assembly into correct alignment. This substitution eliminates complex optics and spinning mechanisms while achieving the same alignment function through simpler mechanical guidance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The guide members act as intermediaries between the frame assembly and the loading port, providing a mechanical pathway that passively guides the frame assembly into correct alignment without requiring active measurement or complex control systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If a slow spinning table and optics are used to determine frame assembly position, then alignment precision is improved, but tool footprint increases

Engineering Contradiction:

Improvealignment precisionVSAvoidtool footprint

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent replaces the mechanical slow spinning table and optical measurement system with a purely mechanical alignment device comprising guide members that physically guide the frame assembly into correct alignment. This substitution eliminates complex optics and spinning mechanisms while achieving the same alignment function through simpler mechanical guidance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If the robot transfers frame assembly without alignment control, then transfer speed is improved, but misalignment occurs leading to mishandling events

Engineering Contradiction:

Improvetransfer speedVSAvoidalignment accuracy

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The alignment device performs preliminary alignment of the frame assembly during the transfer process itself, rather than requiring separate alignment steps before or after transfer. The guide members are positioned to provide alignment guidance throughout the robot's transfer path, ensuring correct alignment is maintained during high-speed operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The guide members act as intermediaries between the frame assembly and the loading port, providing a mechanical pathway that passively guides the frame assembly into correct alignment without requiring active measurement or complex control systems.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11309198B2Wafer processing system

Publication Date: 2022.04.19 SPTS TECH LTD

AI summary

A wafer processing system has a transport vacuum chamber for handling a frame assembly under vacuum conditions, at least one vacuum cassette elevator load lock for housing a cassette and adjusting a vertical position of the cassette under vacuum conditions, and at least one wafer processing module in vacuum communication with the transport vacuum chamber. An actuating assembly changes guide members from an expanded configuration to a contracted configuration to reduce a first cross-sectional dimension of a frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area that is perpendicular to the first cross-sectional dimension.