Wafer Transporter With Integrated Inversion for Dicing Posture Control

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Solution Overview

Problem

Conventional wafer processing apparatuses with separate inversion mechanisms for inverting wafers after dicing are structurally complex.

Innovation Solution

Integrate an inversion mechanism into the wafer transporter to invert the wafer structure, reducing the need for a separate inversion mechanism and simplifying the apparatus structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate inversion mechanism is provided independently, then the wafer can be inverted, but the structure becomes complex

Engineering Contradiction:

Improvewafer inversion capabilityVSAvoidapparatus structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the inversion mechanism with the wafer transporter to form an integrated unit. The transporter includes an inversion unit that can rotate the wafer 180 degrees, eliminating the need for a separate independent inversion mechanism. This merging of functions directly resolves the technical contradiction by maintaining inversion capability while reducing overall structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The wafer transporter is designed to perform multiple functions: transporting the wafer from the storage unit to the dicing unit, and inverting the wafer during transport. This multi-functional design allows a single device to replace what would traditionally require separate dedicated components, thereby reducing apparatus complexity while maintaining full operational capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If the wafer structure without ring-shaped member is supplied, then the wafer may not be supplied in a posture suitable for dicing, but the inversion mechanism enables appropriate posture adjustment

Engineering Contradiction:

Improvewafer posture adjustmentVSAvoidinversion mechanism

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The inversion mechanism performs the posture adjustment action in advance during the transport phase, before the wafer reaches the dicing unit. By pre-positioning the wafer in the correct orientation during transport, the system ensures the wafer is ready for dicing without requiring additional adjustment mechanisms at the dicing station, thus maintaining simplicity while achieving adaptability.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated inversion mechanism allows for stable and efficient wafer inversion without increasing structural complexity, enabling appropriate dicing and expansion of wafers with or without ring-shaped members, and improving processing flexibility.

Implementation Method 1

a suction unit configured to suction the wafer structure

Methodology Applied

Scientific EffectSuction: Suction

Data Source

PatentUS20250336705A1Wafer processing apparatus, semiconductor chip manufacturing method, and semiconductor chip

Publication Date: 2025.10.30 YAMAHA MOTOR CO LTD

AI summary

A wafer processing apparatus includes a wafer storage configured to store a wafer structure, a dicer configured to perform dicing on a wafer of the wafer structure supplied from the wafer storage, and a wafer transporter configured to transport the wafer structure between the wafer storage and the dicer. The wafer transporter includes an inversion mechanism configured to invert a posture of the wafer structure.