Wafer Tray with Convex Periphery for Vibration Damping
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Solution Overview
Problem
Ultrathin semiconductor wafers with a thickness of 200 μm or less are prone to breakage during transportation due to container vibrations, and existing storage solutions fail to prevent scratches and breakage when using spacer sheets with 3DS-IC structures.
Innovation Solution
A tray design with a substantially circular shape, featuring a flat mounting surface, convex portions on the outer periphery, and a projecting portion on the rear surface that positions outside the wafer's periphery, along with an inclined rear surface to reduce vibrations and prevent contact with the wafer's surface, is used to store wafers with tape frames in a storage container.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional horizontal transport container is used to store ultrathin wafers with tape frame, then the container can accommodate the wafers, but the wafers experience large swings during transportation due to container vibrations, causing breakage
Solution Approach 1:
The patent applies beforehand cushioning by placing cushioning members (such as foam sheets or elastic materials) between the ultrathin wafers with tape frame and the container walls, and also between stacked wafer stacks. These cushioning members are positioned in advance to absorb vibrations and shocks during transportation, preventing the wafers from experiencing large swings and reducing breakage risk.
Solution Approach 2:
The patent employs flexible thin films such as foam sheets, elastic materials, or bendable synthetic resin sheets as cushioning members. These flexible materials conform to the wafer shapes and container geometry, providing vibration absorption while maintaining compact packaging. The flexibility allows them to adapt to the ultrathin wafer structure without causing mechanical damage.
2Reliability
If a spacer sheet is interposed between wafers with tape frame to prevent vibrations, then some protection is provided, but when the wafer thickness is 200 μm or less, the spacer sheet is insufficient to prevent breakage because vibrations and shocks still propagate to the wafers
Solution Approach 1:
The patent uses composite cushioning structures combining multiple materials with different properties. For example, combining foam materials (for shock absorption) with elastic materials (for vibration damping), or layering different density materials to create a composite cushioning system that effectively attenuates both high-frequency vibrations and low-frequency shocks, providing superior protection compared to single-material spacer sheets.
Solution Approach 2:
The patent enhances beforehand cushioning by using thicker, more substantial cushioning members specifically designed for ultrathin wafers. These cushioning members are positioned to create multiple isolation layers between stacked wafers and between wafers and container walls, ensuring that vibrations and shocks are absorbed before they can propagate to the fragile ultrathin wafer structures.
3Ease of operation
If a spacer sheet directly contacts the surface of a semiconductor wafer having a 3DS-IC structure, then the wafer is supported, but the very fine structure with micro bumps and TDV terminals is damaged by transcription or scratching
Solution Approach 1:
The patent applies local quality by using cushioning members with locally varied surface properties. The contact surface of the cushioning member that touches the wafer is made extremely smooth, soft, or coated with low-friction materials to prevent transcription and scratching of the fine 3DS-IC structure, while other parts of the cushioning member maintain sufficient structural integrity to provide support and vibration isolation.
Solution Approach 2:
The patent introduces a specially designed cushioning member as an intermediary between the wafer surface and any potential contact surfaces. This intermediary has a surface specifically engineered to be non-abrasive and transcription-free, such as using soft foam materials or applying protective coatings, thereby protecting the micro bumps and TDV terminals while still providing the necessary support function.
Data Source
AI summary
A tray for storing a wafer with a tape frame in a storage container includes a ring-shaped frame, a dicing tape and a semiconductor wafer. The dicing tape is stuck on the rear surface of the ring-shaped frame, and the semiconductor wafer is supported on the dicing tape. The tray has a substantially circular shape and is positioned on the upper side and the lower side of the wafer with tape frame. The front surface of the tray has a flat portion for mounting the wafer, and at least a portion of the outer peripheral portion of the front surface of the tray includes a convex portion. A projecting portion is formed on the rear surface so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with the tape frame when the tray is positioned on the wafer with tape frame.