Wafer-Level Waveguide Package for Low-Loss THz IC Coupling
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Solution Overview
Problem
The high cost and size of millimeter wave and THz signal systems are limited by component packaging and system integration, requiring manual work and expensive manufacturing, which is not scalable for large volumes, and are needed for applications in security imaging, spectroscopy, and radar imaging.
Innovation Solution
A wafer-level package with a multi-layer structure comprising a top, middle, and bottom substrate, forming a waveguide and using a probe to couple an integrated circuit to the waveguide, with features like metal patterning, trenches, and flip-chip bonding to reduce manual work and improve alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual work and expensive high-accuracy manufacturing are used for component packaging and system integration, then alignment accuracy and reliability are improved, but cost and device complexity increase significantly
Solution Approach 1:
The package is divided into three separate substrates (top, middle, bottom) that can be fabricated independently using standard wafer-level processes, then assembled together. This segmentation allows each substrate to be manufactured with standard precision while achieving overall high alignment accuracy through the standardized interface design between substrates.
Solution Approach 2:
The middle substrate acts as an intermediary component that provides standardized mechanical and electrical interfaces between the top substrate (containing the integrated circuit) and the bottom substrate (containing the waveguide). This intermediary layer enables automated assembly with high precision without requiring complex manual alignment procedures.
2Manufacturing precision
If manual work is used for component packaging and system integration, then alignment accuracy is improved, but productivity decreases and labor costs increase
Solution Approach 1:
All alignment features, mechanical interfaces, and electrical connections are pre-configured on the substrates during wafer-level fabrication. The substrates arrive at assembly already prepared with precise feature locations, eliminating the need for manual alignment operations and enabling direct automated assembly with high throughput.
Solution Approach 2:
Manual mechanical alignment operations are replaced by standardized mechanical features built into the substrate interfaces during fabrication. The rigid mechanical structures and predefined alignment features enable automated pick-and-place or flip-chip bonding processes to achieve high-precision assembly without human intervention.
3Ease of manufacture
If standard packaging methods are used, then manufacturing cost is reduced, but signal loss and reliability deteriorate at millimeter wave and THz frequencies
Solution Approach 1:
The middle substrate is designed with localized optimized features including a probe with specific geometry and positioning, feed line configurations, and ground plane arrangements tailored for millimeter wave and THz signal transmission. These local optimizations minimize signal loss and electromagnetic interference while maintaining compatibility with standard wafer-level manufacturing processes.
Solution Approach 2:
The middle substrate serves as a specialized intermediary designed specifically for high-frequency signal transmission, providing controlled impedance pathways, proper grounding, and minimized parasitic effects between the integrated circuit and waveguide. This dedicated intermediary structure enables low-loss signal transfer at millimeter wave and THz frequencies using automated assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective, mass-producible, and robust transitions between integrated circuits and waveguides, reducing labor costs and minimizing losses, thus lowering the price and size of millimeter wave and THz signal systems.
Implementation Method 1
the probe is arranged to couple a signal coming from the integrated circuit to the waveguide, or to couple a signal coming from the waveguide to the integrated circuit
Implementation Method 2
the recess of the top substrate and the recess of the bottom substrate are arranged to form a waveguide within the wafer-level package
Data Source
AI summary
According to an example aspect of the present invention, there is provided a wafer-level package (1), comprising a top substrate (10) and a bottom substrate (30), wherein the top substrate (10) comprises a recess (12) on a side of the top substrate (10) which is towards the bottom substrate (30) and the bottom substrate (30) comprises a recess (32) on a side of the bottom substrate (30) which is towards the top substrate (10), wherein the recess (12) of the top substrate (10) and the recess (32) of the bottom substrate (30) are arranged to form a waveguide (5) within the wafer-level package (1) and a middle substrate (20) arranged to couple an integrated circuit (24) of the wafer-level package (1) to the waveguide (5), wherein the middle substrate (20) is in between the top substrate (10) and the bottom substrate (30) and the middle substrate (20) comprises a probe (21), wherein the probe (21) extends to the waveguide (5) and the probe (21) is arranged to couple a signal coming from the integrated circuit (24) to the waveguide (5), or to couple a signal coming from the waveguide (5) to the integrated circuit (24).