Water-Based Light-Release Composition for Semiconductor Lamination
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Solution Overview
Problem
Existing release agent compositions for semiconductor substrates and electronic device layers rely on organic solvents, which pose environmental and safety concerns, and there is a need for a more efficient release method that can handle the increasing complexity of semiconductor processing.
Innovation Solution
A release agent composition using an aqueous solvent, specifically containing a light-absorbing compound such as polyphenol-based compounds and a water-soluble dye, which forms a release agent layer that can be easily separated from a support substrate by light irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a release agent composition containing organic solvent is used, then the release function can be achieved, but environmental load increases and handling safety deteriorates
Solution Approach 1:
The patent changes the solvent parameter from organic to aqueous (water-based), specifically using water as the primary solvent instead of organic solvents. This parameter change maintains the release function while eliminating the harmful effects of organic solvents, thereby reducing environmental load and improving handling safety.
Solution Approach 2:
The patent creates a composite release agent composition consisting of water (solvent), light-absorbing compound (functional additive), and optional water-soluble dye. This composite formulation achieves the release function through the light-absorbing compound while using water as the safe and environmentally friendly base solvent.
2Length of moving object
If the substrate thickness is reduced to reduce semiconductor package size, then package size decreases, but substrate strength is reduced and damage risk increases
Solution Approach 1:
The patent introduces a support substrate as an intermediary element that temporarily supports the thin semiconductor substrate during processing. The support substrate compensates for the reduced strength of the thinned substrate, enabling handling and processing without damage while maintaining the reduced thickness for final package size.
Solution Approach 2:
The patent performs preliminary thinning of the semiconductor substrate to the desired reduced thickness before final processing and packaging. This allows the substrate to be processed in its thinned state while still supported by the support substrate, ensuring both reduced final package size and protection during processing.
3Reliability
If a light-absorbing compound is added to the release agent composition, then light irradiation release function is enabled, but composition complexity increases
Solution Approach 1:
The light-absorbing compound in the composition enables the release agent layer to perform the release function autonomously through light irradiation. The compound absorbs light energy and converts it to thermal energy, which automatically triggers the release of the semiconductor substrate from the support substrate without requiring additional mechanical or chemical intervention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for a safe and environmentally friendly release process, reducing the environmental load and improving handling safety, while ensuring effective separation of semiconductor substrates and electronic device layers from support substrates.
Implementation Method 1
the release agent layer absorbs light irradiated from the support substrate side
Implementation Method 2
after the release agent layer absorbs light irradiated from the support substrate side, in the laminate in which a support substrate and a semiconductor substrate or an electronic device layer can be firmly adhered to each other
Data Source
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AI summary
There is provided a release agent composition containing an aqueous solvent, that is, a release agent composition for forming a release agent layer that can be released by light irradiation and is used for a laminate, in the laminate in which a support substrate and a semiconductor substrate or an electronic device layer can be firmly adhered to each other during processing of the semiconductor substrate or the electronic device layer, and the support substrate and the semiconductor substrate or the electronic device layer can be easily separated from each other by light irradiation after the substrate processing. There is provided a release agent composition for light irradiation release for forming a release agent layer of a laminate which includes a semiconductor substrate or an electronic device layer, a light-transmissive support substrate, and a release agent layer provided between the semiconductor substrate or the electronic device layer and the support substrate, in which the electronic device layer includes a plurality of semiconductor chip substrates and a sealing resin disposed between the semiconductor chip substrates, and which is used for releasing the semiconductor substrate or the electronic device layer from the support substrate after the release agent layer absorbs light irradiated from the support substrate side, in which the release agent composition contains a light-absorbing compound that contributes to making the semiconductor substrate or the electronic device layer and the support substrate easily released by absorbing the light, and a solvent, and the solvent contains water.