Water Cooling Head Module with Heat Conducting Member for Multi-Source Dissipation
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Solution Overview
Problem
Existing heat dissipation devices struggle to efficiently dissipate heat from multiple heat sources on a circuit board within a limited space, as they often require complex structures and significant space to achieve effective cooling.
Innovation Solution
A heat dissipation device comprising a water cooling head module thermally coupled to a primary heat source and a heat conducting member that extends into the module and is also thermally coupled to a secondary heat source, utilizing a heat pipe and fins to efficiently transfer heat from both sources through a single water cooling head module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single water cooling head module is used to dissipate heat from multiple heat sources, then the device occupies less space and has simpler structure, but the heat dissipation efficiency from each individual heat source may be reduced
Solution Approach 1:
The patent merges multiple heat dissipation functions into a single water cooling head module by introducing a heat conducting member that thermally couples both the primary heat source (directly under the module) and secondary heat sources (via extended pipes). This consolidation reduces structural complexity while maintaining effective heat dissipation through the integrated water cooling system.
Solution Approach 2:
The heat conducting member acts as an intermediary between the secondary heat sources and the water cooling head module. It includes heat pipes and conducting pipes that transfer heat from distant heat sources to the cooling module, enabling efficient heat dissipation without requiring separate cooling systems for each heat source.
2Loss of energy
If multiple separate water cooling modules are used to dissipate heat from different heat sources, then each heat source receives dedicated cooling, but the device occupies more space and becomes more complex
Solution Approach 1:
The patent combines multiple cooling functions into one integrated water cooling head module, eliminating the need for separate cooling modules for each heat source. The unified structure reduces space occupation and structural complexity while maintaining effective heat dissipation through the shared water cooling system.
Solution Approach 2:
The water cooling head module is designed with multi-functionality to serve multiple heat sources simultaneously. The module universally handles heat dissipation from both the primary heat source directly beneath it and secondary heat sources connected via heat conducting members, reducing the total number of components needed.
3Adaptability or versatility
If heat conducting members with heat pipes are used to extend cooling to secondary heat sources, then heat dissipation coverage is expanded without increasing module size, but the manufacturing complexity increases
Solution Approach 1:
The patent employs heat pipes that utilize phase transition (evaporation and condensation) of working fluid to transfer heat efficiently over extended distances. This phase change mechanism enables high heat dissipation coverage without proportionally increasing manufacturing complexity, as the heat pipe structure is self-contained and modular.
Solution Approach 2:
The heat conducting member integrates multiple functional elements (heat pipes, conducting pipes, and mounting structures) into a nested configuration within the water cooling head module. This nesting approach allows expanded heat dissipation coverage while managing manufacturing complexity through integrated rather than separate component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for simultaneous heat dissipation from multiple heat sources within a compact space, enhancing overall heat dissipation efficiency and extending the applicability of the device to various circuit board configurations.
Implementation Method 1
The heat conducting member is thermally coupled to the secondary heat source and extends into the water cooling head module
Implementation Method 2
The heat conducting member includes a heat pipe
Implementation Method 3
The fins extend along a first direction and are arranged in parallel along a second direction in the water cooling tank
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A heat dissipation device (100,100a,100b) is adapted to be disposed on a primary heat source (10) and a secondary heat source (50). The heat dissipation device (100,100a,100b) includes a water cooling head module (110,110a,110b) and a heat conducting member (120,120a,120b). The water cooling head module (110,110a,110b) is disposed on the primary heat source (10). The heat conducting member (120,120a,120b) is thermally coupled to the secondary heat source (50) and extends into the water cooling head module (110,110a,110b).