Waved Metal Pad Interface for AMOLED ITO Adhesion
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Solution Overview
Problem
In active matrix organic light-emitting diode (AMOLED) display panels, the indium tin oxide (ITO) layer in non-displaying regions is prone to peeling, leading to contact failures between IC/FPC and the panel, causing corrosion and reducing connection stability and lifespan.
Innovation Solution
The introduction of a rugged contact surface between the second metal layer and the transparent conductive layer, achieved through strategically defined via holes and layers, enhances the connection stability and prevents corrosion by ensuring a secure attachment of the transparent conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the transparent conductive layer (ITO) is added to the pad region in the non-displaying area, then the corrosion resistance and chemical stability are improved, but the layer is prone to peeling and separation causing contact failure
Solution Approach 1:
The patent applies curvature by forming a waved surface on the metal layer instead of using a flat surface. The waved surface creates mechanical interlocking with the transparent conductive layer, preventing peeling and separation while maintaining corrosion resistance. This resolves the contradiction between improving corrosion resistance through ITO addition and maintaining layer adhesion stability.
2Stability of the object's composition
If the transparent conductive layer is omitted in the pad region to prevent peeling, then the layer adhesion stability is improved, but the metal layer becomes easily corroded and connection stability decreases
Solution Approach 1:
The waved surface configuration provides mechanical interlocking that secures the transparent conductive layer to the metal layer, preventing peeling while maintaining corrosion protection. This allows both layer adhesion stability and connection stability to be improved simultaneously.
Solution Approach 2:
The patent uses a composite structure consisting of multiple layers (metal layer, transparent conductive layer, planarization layer) with a waved interface. This composite design combines the corrosion resistance of the transparent conductive layer with the mechanical interlocking of the waved surface to achieve both adhesion stability and connection reliability.
3Ease of manufacture
If a flat contact surface is used between the metal layer and transparent conductive layer, then the manufacturing simplicity is maintained, but the connection stability is reduced due to easy peeling
Solution Approach 1:
The waved surface can be formed through standard semiconductor manufacturing processes such as etching or deposition techniques, maintaining manufacturing simplicity while significantly improving connection stability through mechanical interlocking. The curvature provides anti-peeling effect without requiring complex manufacturing steps.
Data Source
AI summary
An active matrix organic light-emitting diode display panel is provided and includes a first metal layer, an interlayer dielectric layer, a second metal layer, a planarization layer and a transparent conductive layer sequentially located on a substrate. Second via holes are defined in the planarization layer. The transparent conductive layer is connected to the second metal layer through the second via holes. A contact surface of the second metal layer and the transparent conductive layer is a waved surface.