Waveguide Circuit Board Injection Molding Manufacturing
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Solution Overview
Problem
The integration of rectangular waveguides into high-frequency PCBs is hindered by the need for a large number of metal through holes, which increases costs and reduces product yield due to high accuracy requirements.
Innovation Solution
A method of manufacturing a circuit board with waveguides using injection molding of thermoplastic polymer materials, where waveguides and connecting portions are formed with a smooth surface and accurate size, and a metal layer is applied to reduce signal loss and eliminate the need for metal through vias, thereby simplifying the manufacturing process and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional substrate integrated waveguide is manufactured using metal through holes, then waveguide transmission characteristics can be achieved, but the number of metal through holes becomes very large and accuracy requirements become high, leading to increased cost and reduced product yield
Solution Approach 1:
The patent merges the waveguide structure with the PCB substrate by embedding conductive patterns directly into the substrate layers, eliminating the need for separate metal through holes. The waveguide is formed by creating conductive paths within the substrate itself, combining the substrate and waveguide into a single integrated structure.
Solution Approach 2:
The patent extracts the metal through holes from the waveguide structure and replaces them with conductive patterns formed on substrate surfaces and within substrate layers. This extraction eliminates the complex through-hole manufacturing process while maintaining waveguide functionality through alternative conductive path configurations.
2Reliability
If metal through holes are used to form waveguides, then transmission line energy containment is ensured, but manufacturing accuracy requirements become very high, reducing product yield
Solution Approach 1:
The patent replaces the mechanical through-hole drilling and plating process with a printing or deposition process that forms conductive patterns directly on and within the substrate. This substitution eliminates the need for precise mechanical alignment and drilling, significantly reducing manufacturing accuracy requirements while maintaining energy containment through the continuous conductive paths.
3Ease of manufacture
If a large number of metal through holes are used for waveguide integration, then waveguide structure is formed, but manufacturing cost increases and product yield decreases
Solution Approach 1:
The patent changes the manufacturing parameters from traditional through-hole drilling and plating to printing or deposition processes. This parameter change allows for more tolerant manufacturing conditions, higher production speeds, and better yield, while still achieving the required waveguide structure and electrical characteristics.
Data Source
AI summary
A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.