Hollow Waveguide Conductor Pin for Low-Loss Signal Transmission
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Solution Overview
Problem
Conventional waveguides used in electronic devices are large in size, making it difficult to manufacture small electronic devices while maintaining low-loss signal transmission, and reducing the size leads to insufficient impedance matching and poor signal transmission.
Innovation Solution
An electronic apparatus with a waveguide structure that includes a substrate, a hollow waveguide with a lower conductor and an upper conductor connected by a sidewall conductor, and a conductor pin that penetrates an opening in the lower conductor to connect to the upper conductor, allowing for low-loss signal transmission while reducing the waveguide's thickness to one-tenth of conventional designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional waveguide structures are used, then low-loss signal transmission is achieved, but the waveguide size becomes large
Solution Approach 1:
The patent transitions from a conventional planar waveguide structure to a three-dimensional hollow waveguide structure with vertical conductors extending above the substrate. This dimensional change allows the waveguide to achieve low-loss transmission characteristics while reducing the lateral footprint and overall device area, effectively resolving the contradiction between transmission performance and size.
Solution Approach 2:
The patent employs thin film deposition techniques to create the waveguide structure, using conformal coating methods to form uniform conductor layers on complex three-dimensional surfaces. This allows the waveguide to maintain low-loss characteristics through precise thickness control while achieving compact overall dimensions through thin-film integration.
2Volume of moving object
If waveguide size is reduced, then device downsizing is achieved, but impedance matching becomes insufficient and signal transmission deteriorates
Solution Approach 1:
The patent systematically optimizes multiple geometric parameters including conductor thickness, conductor width, spacing between conductors, and the height of vertical conductor elements. By adjusting these parameters, the waveguide achieves proper impedance matching (typically 50 ohms) while maintaining compact dimensions, thus improving both size and transmission quality simultaneously.
Solution Approach 2:
The patent employs simulation and measurement feedback to iteratively optimize the waveguide design, adjusting geometric parameters based on observed impedance and transmission characteristics. This dynamic optimization process ensures that the final design achieves both compact size and reliable signal transmission.
Data Source
AI summary
An electronic apparatus has a substrate having a signal terminal and a waveguide formed above the substrate. The waveguide includes a lower conductor having an opening at a position corresponding to the signal terminal of the substrate and an upper conductor arranged above the lower conductor. A conductor pin is formed on the signal terminal, the conductor pin penetrating the opening without contacting the lower conductor of the waveguide. The conductor pin is connected to the upper conductor above the lower conductor.