Waveguide Interface Structure for Low-Loss RF Signal Packaging
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Solution Overview
Problem
Existing automotive radar systems face challenges in improving performance while minimizing cost, particularly in reducing signal loss in semiconductor device packaging.
Innovation Solution
A semiconductor device with a low loss waveguide interface is developed, featuring a semiconductor die and radiating element structures encapsulated with an encapsulant, where a conductive surrounding ring is exposed and a waveguide interface material forms a contiguous conductive channel, preventing lateral RF signal radiation and minimizing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional semiconductor device packaging is used, then manufacturing simplicity is maintained, but signal loss increases due to lateral RF signal radiation
Solution Approach 1:
A waveguide interface material is introduced as an intermediary component between the radiating element and the external environment. This material forms a controlled interface that guides RF signals vertically while preventing lateral radiation, thus reducing signal loss without requiring complete redesign of the entire packaging structure
Solution Approach 2:
The waveguide interface material is applied locally at the critical interface region where RF signals exit the radiating element. By concentrating the signal control function at this specific location rather than throughout the entire package, the solution reduces signal loss at the most critical point while maintaining overall packaging simplicity
2Loss of energy
If waveguide interface material is added to prevent lateral RF radiation, then signal loss is minimized, but manufacturing complexity increases
Solution Approach 1:
The waveguide interface material is characterized by specific electrical parameters (conductive properties, dielectric constant, loss tangent) that are optimized to achieve the desired RF signal guidance. By controlling these material parameters, the patent achieves effective signal loss reduction while maintaining compatibility with existing manufacturing processes
Solution Approach 2:
The waveguide interface material is applied during the encapsulation process before final device assembly. This preliminary application ensures proper positioning and integration with the radiating element, simplifying subsequent manufacturing steps and reducing overall process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes signal loss in the vertical propagation path by preventing lateral RF signal radiation, thereby enhancing the performance of automotive radar systems while maintaining cost-effectiveness.
Implementation Method 1
a substantially contiguous conductive waveguide channel is formed surrounding respective radiating elements. When a waveguide structure is affixed to the semiconductor device, the substantially contiguous conductive waveguide channel extends from the one or more radiating element structures through the waveguide structure
Data Source
AI summary
A method of forming a semiconductor device is provided. The method includes providing a radiating element structure and a semiconductor die. The radiating element structure includes a non-conductive substrate, a radiating element formed at a top side of the non-conductive substrate, and a conductive ring formed at the top side of the non-conductive substrate substantially surrounding the radiating element. The semiconductor die is interconnected with the radiating element by way of a conductive trace. An encapsulant encapsulates at least a portion of the radiating element structure. A top surface of the conductive ring exposed at a top surface of the encapsulant. A waveguide interface material is applied on at least a portion of the top surface of the encapsulant.