Wafer-Scale Waveguide Interface Molding for Millimeter-Wave Packaging
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Solution Overview
Problem
Conventional semiconductor manufacturing processes struggle to create high-frequency circuit waveguide interfaces for packaged semiconductor devices, leading to increased cost and complexity.
Innovation Solution
The integration of a circuit waveguide interface during the wafer-scale die packaging (WSDP) process, using wafer-type processing techniques to form metallization layers and components like conductors, reflector interfaces, and excitation elements within the package, allowing for precise and cost-effective high-frequency connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor manufacturing processes are used to create waveguide interfaces, then manufacturing simplicity is maintained, but manufacturing precision and high-frequency performance are insufficient
Solution Approach 1:
The waveguide interface structure is segmented into multiple functional layers: a bottom ground plane layer, a dielectric layer, a top signal layer with conductive traces, and a molding compound layer. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall manufacturing simplicity through standard PCB fabrication processes.
Solution Approach 2:
The waveguide interface transitions from a two-dimensional circuit board surface to a three-dimensional structure by creating a cavity within the molding compound that accommodates the semiconductor device. This dimensional transition enables precise positioning and coupling of the waveguide to the device while maintaining manufacturing simplicity.
2Adaptability or versatility
If additional high-frequency capability is added to packaged semiconductor devices, then high-frequency communication performance is improved, but manufacturing cost and process complexity increase significantly
Solution Approach 1:
The circuit board structure serves multiple functions: it provides mechanical support for the semiconductor device, electrical grounding through the bottom ground plane, signal transmission through the top signal layer, and waveguide coupling through the molded cavity. This multi-functionality eliminates the need for separate components and reduces manufacturing complexity.
Solution Approach 2:
The molding compound serves dual purposes: it protects the semiconductor device and simultaneously forms the waveguide interface structure. The cavity is created during the molding process itself, eliminating the need for separate machining or assembly steps and reducing manufacturing cost.
3Reliability
If precise waveguide interfaces are manufactured using specialized processes, then high-frequency performance is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The waveguide interface parameters such as trace width, spacing, and cavity dimensions are optimized for high-frequency performance while being manufactured using standard PCB processes. The conductive traces are formed with precise dimensions through standard photolithography and etching processes, achieving high-frequency reliability without specialized manufacturing.
Data Source
AI summary
The embodiments described herein provide for the formation of circuit waveguide interfaces during a wafer-scale die packaging (WSDP) process. Specifically, during the packaging process singulated die are arranged on a wafer-like panel and covered with molding compound that will provide the bodies of the packages. A circuit waveguide interface is formed in the molding compound and subsequent metallization layers. This circuit waveguide interface can include an array of first conductors arranged in the molding compound, and a reflector interface and excitation element formed during metallization.