Optical Waveguide Package Sealing for Airtight Heat Management
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Solution Overview
Problem
Existing optical waveguide packages and light-emitting devices face challenges in maintaining airtightness and thermal management, which can lead to deformation and reduced optical transmission due to thermal stress and stray light issues.
Innovation Solution
The optical waveguide package includes a substrate with a cladding and core, a metal member between the cladding and a lid, and a lens for light emission, which enhances airtightness and thermal management by using a metal member to surround the element-receiving areas and incorporating a protrusion or step for reduced heat transfer and improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a lid covers the element-receiving area in existing optical waveguide packages, then the structural integrity is improved, but airtightness deteriorates due to gaps between the lid and cladding
Solution Approach 1:
A metal member is introduced as an intermediary component between the lid and the cladding. This metal member fills the gap between the lid and cladding, providing both mechanical support for structural integrity and sealing function for airtightness. The metal member acts as a mediator that simultaneously addresses both requirements without compromising either.
2Temperature
If heat transfer is increased in existing light-emitting devices, then thermal management is improved, but thermal stress and deformation worsen
Solution Approach 1:
The metal member is selectively positioned only in specific regions where heat generation occurs (around the element-receiving area). This local placement provides enhanced thermal management precisely where needed, while avoiding excessive heat transfer in other regions that could cause thermal stress and deformation. The local quality approach allows differentiated thermal control in different zones of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves airtightness, reduces thermal stress, and maintains optical transmission quality by effectively managing heat and stray light, enhancing the performance and reliability of the light-emitting device.
Implementation Method 1
a metal member between the cladding and the lid
Implementation Method 2
a core in the cladding, a lid covering the element-receiving area
Data Source
AI summary
An optical waveguide package includes a substrate, an optical waveguide layer located on an upper surface of the substrate and including a cladding and a core in the cladding, a lid, and a metal member. The cladding includes a first surface facing the substrate, a second surface opposite to the first surface, and an element-receiving area being open in the second surface. The lid covers the element-receiving area. The metal member surrounds the element-receiving area between the cladding and the lid.


