Optical Waveguide Package Sealing for Airtight Heat Management

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Solution Overview

Problem

Existing optical waveguide packages and light-emitting devices face challenges in maintaining airtightness and thermal management, which can lead to deformation and reduced optical transmission due to thermal stress and stray light issues.

Innovation Solution

The optical waveguide package includes a substrate with a cladding and core, a metal member between the cladding and a lid, and a lens for light emission, which enhances airtightness and thermal management by using a metal member to surround the element-receiving areas and incorporating a protrusion or step for reduced heat transfer and improved bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a lid covers the element-receiving area in existing optical waveguide packages, then the structural integrity is improved, but airtightness deteriorates due to gaps between the lid and cladding

Engineering Contradiction:
Improvestructural integrityVSAvoidairtightness
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

A metal member is introduced as an intermediary component between the lid and the cladding. This metal member fills the gap between the lid and cladding, providing both mechanical support for structural integrity and sealing function for airtightness. The metal member acts as a mediator that simultaneously addresses both requirements without compromising either.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat transfer is increased in existing light-emitting devices, then thermal management is improved, but thermal stress and deformation worsen

Engineering Contradiction:
Improvethermal managementVSAvoidthermal stress and deformation
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The metal member is selectively positioned only in specific regions where heat generation occurs (around the element-receiving area). This local placement provides enhanced thermal management precisely where needed, while avoiding excessive heat transfer in other regions that could cause thermal stress and deformation. The local quality approach allows differentiated thermal control in different zones of the device.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves airtightness, reduces thermal stress, and maintains optical transmission quality by effectively managing heat and stray light, enhancing the performance and reliability of the light-emitting device.

Implementation Method 1

a metal member between the cladding and the lid

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a core in the cladding, a lid covering the element-receiving area

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS12181723B2Optical waveguide package and light-emitting device
Publication Date: 2024.12.31 KYOCERA CORP
  • US12181723B2 patent drawing
  • US12181723B2 patent drawing
  • US12181723B2 patent drawing

AI summary

An optical waveguide package includes a substrate, an optical waveguide layer located on an upper surface of the substrate and including a cladding and a core in the cladding, a lid, and a metal member. The cladding includes a first surface facing the substrate, a second surface opposite to the first surface, and an element-receiving area being open in the second surface. The lid covers the element-receiving area. The metal member surrounds the element-receiving area between the cladding and the lid.