Image Capturing Apparatus Waveguide Planarization Method
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Solution Overview
Problem
The deposition of material for light waveguides in image capturing apparatuses can result in foreign particles adhering to the processing chamber, which are then incorporated into the deposited film and cause defects during planarization, leading to concave shape defects on the waveguide surface. These defects can expose wiring patterns during etching, causing conduction errors.
Innovation Solution
A method involving the formation of a first film to cover the imaging and peripheral regions, followed by planarization to create a flat waveguide member, and then a second film is deposited and polished to expose the waveguide member. The waveguide member above the peripheral region is partially removed to expose the interlayer insulation film, preventing exposure of wiring patterns during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a material film for light waveguide is deposited and planarized by CMP method, then a flat light waveguide surface is formed, but foreign particles in the deposited film can be missed by mechanical external force, generating concave shape defects on the surface
Solution Approach 1:
The patent applies preliminary action by performing a first planarization step before subsequent etching processes. The light waveguide layer is planarized early in the manufacturing sequence, creating a flat surface that prevents foreign particles from being trapped during later etching operations. This preliminary planarization eliminates the risk of concave defects forming during subsequent processing steps.
2Manufacturing precision
If the light waveguide is planarized by CMP method, then the surface is flattened, but foreign particles can be missed by mechanical external force, causing defect portions that expose interlayer insulation film during etching
Solution Approach 1:
The patent performs planarization of the light waveguide layer before subsequent etching operations. This preliminary action creates a uniformly flat surface that ensures consistent etching depth across the entire wafer, preventing localized over-etching that would expose the interlayer insulation film and wiring patterns.
Solution Approach 2:
The patent applies beforehand cushioning by creating a planarized light waveguide layer that acts as a protective cushion during subsequent etching processes. The uniform thickness and flatness of this layer prevent mechanical external forces during etching from exposing underlying wiring patterns, thereby cushioning against potential damage.
3Productivity
If wiring patterns are exposed during etching, then they may be etched by processes for removing resist mask or byproducts, causing conduction errors
Solution Approach 1:
The patent performs preliminary planarization of the light waveguide layer before etching operations. This creates a uniformly flat surface that serves as a protective barrier, ensuring that subsequent etching processes remove only the intended material without exposing or damaging the underlying wiring patterns, thus maintaining conduction integrity.
Solution Approach 2:
The planarized light waveguide layer acts as a beforehand cushioning layer that protects the wiring patterns from mechanical external forces during etching. This cushioning effect prevents the etching process from penetrating through to the wiring patterns, thereby preventing conduction errors while allowing complete removal of resist masks and byproducts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses conduction errors in the wiring patterns by preventing the exposure of wiring patterns during etching, thereby enhancing the manufacturing yield of image capturing apparatuses.
Implementation Method 1
forming a first film made of a first material so as to cover the structure arranged above the imaging region and the peripheral region while filling the plurality of opening portions
Implementation Method 2
planarizing the first film to form, above the imaging region and the peripheral region, a waveguide member having an upper surface with a flat surface
Implementation Method 3
forming, above the imaging region and the peripheral region, a second film made of a second material so as to cover the waveguide member after the planarizing the first film
Implementation Method 4
polishing the second film to expose the waveguide member arranged above the imaging region
Data Source
AI summary
A method of manufacturing an image capturing apparatus is provided. The method comprises forming a structure which includes an interlayer insulation film having a plurality of opening portions above an imaging and a peripheral region, forming a first film so as to cover the structure arranged above the imaging and the peripheral region while filling the plurality of opening portions, planarizing the first film to form a waveguide member above the imaging and the peripheral region, forming a second film so as to cover the waveguide member above the imaging and the peripheral region after the planarizing the first film, polishing the second film to expose the waveguide member arranged above the imaging region and removing a portion of the waveguide member arranged above the peripheral region so as to expose the interlayer insulation film after the polishing the second film.