Wearable Thermal Dissipation via Noncontiguous Support Structure

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Solution Overview

Problem

Wearable electronic devices face challenges in thermal dissipation due to limited surface area for heat dissipation, especially when heat-emitting components are in contact with the user's skin, as conventional systems rely on contiguous heat dissipation structures that are not optimal for thermal management.

Innovation Solution

A thermal dissipation system that transfers heat from a housing enclosing heat-emitting components to a support assembly, utilizing noncontiguous regions of the support structure with varying thermal resistances and materials to efficiently dissipate heat away from the device, including the use of thermally conductive materials and heat sinks to maximize surface area contact with the ambient environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat is dissipated through the housing and contiguous structures, then thermal dissipation is achieved, but the surface area available for heat dissipation is insufficient

Engineering Contradiction:

Improvesurface temperatureVSAvoidsurface area for heat dissipation

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent extends heat dissipation from the traditional housing surface to the support structure that contacts the user's body. This utilizes a different spatial dimension (the support structure extending from the housing) to provide additional heat dissipation surface area, thereby resolving the contradiction between limited housing surface area and the need for effective thermal dissipation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces a thermal interface material as an intermediary between the heat-generating housing and the support structure. This intermediary facilitates efficient heat transfer from the housing to the support structure, enabling the support structure to serve as an effective heat dissipation path despite being noncontiguous with the housing.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Illumination intensity

If the display assembly is positioned toward the front for visibility, then image generation is effective, but the grab points become suboptimal for thermal dissipation

Engineering Contradiction:

Improveimage visibilityVSAvoidsurface temperature at grab points

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The patent applies different thermal characteristics to different regions of the support structure. Specifically, it positions thermal dissipation features at regions less likely to be grasped by the user, while maintaining the display assembly's optimal front-facing position for visibility. This local differentiation of thermal management strategies resolves the contradiction between visibility requirements and thermal comfort at grab points.

Inventive Principle:

Principle #3Local quality

3Area of stationary object

If thermal dissipation structures are made noncontiguous with the housing, then additional surface area is utilized, but thermal resistance increases

Engineering Contradiction:

Improvesurface area for heat dissipationVSAvoidthermal resistance

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively dissipates heat through noncontiguous regions of the support structure, maintaining the device at a safe surface temperature and reducing the likelihood of the user grasping a warm or hot surface, while optimizing thermal management for wearable devices.

Implementation Method 1

a thermal conduit that is positioned to absorb heat emitted by the heat source within the housing and to transfer at least a portion of the heat away from the housing and through a plurality of regions of the support structure

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

Various regions of the support structure have different thermal resistances between the thermal conduit and an ambient environment

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

dissipate the heat through a region of the support assembly that is noncontiguous with the housing

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10433467B2Thermal dissipation system for wearable electronic devices

Publication Date: 2019.10.01 MICROSOFT TECHNOLOGY LICENSING LLC

AI summary

A thermal dissipation system for wearable electronic devices transfers heat away from a housing enclosing a heat source and dissipates the heat through a region of the support assembly that is noncontiguous with the housing. The support assembly may be coupled to the housing to enable the housing to be worn by a user. Various regions of the support assembly have different thermal resistances between a thermal conduit and an ambient environment. The thermal resistances may decrease as the thermal conduit becomes farther away from the heat source. The variations in thermal resistances enable modulation of relative heat flux between the various regions. For example, heat may be internally routed through the wearable electronic device to be dissipated through a surface that a user does not typically touch during operation.