Weaved Electrical Components in Substrate Package Core
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing semiconductor device packages, such as PCB substrates, are expensive, have low throughput, and result in low yield with mechanical instability, and fail to provide stable and clean power, ground, and high frequency signal transmission between surfaces.
Innovation Solution
A process involving weaving non-conductive glass fibers with conductive strands, such as copper wires, into a substrate core, followed by resin impregnation and curing, which integrates inductors, co-axial PTH, and standard copper-filled PTH directly into the substrate core, eliminating the need for post-curing component embedding and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical drilling, plating and filling process is used to form electrically conductive vias, then electrically conductive vias can be formed, but the manufacturing cost increases, throughput decreases, and yield becomes low
Solution Approach 1:
Conductive strands are woven into the fabric before resin impregnation and curing, establishing the electrical interconnection structure in advance. This eliminates the need for subsequent mechanical drilling, plating, and filling operations, thereby dramatically increasing manufacturing throughput while maintaining via formation quality.
Solution Approach 2:
The conventional mechanical drilling, plating, and filling process is replaced by a weaving process that integrates conductive strands directly into the substrate fabric. This substitution eliminates complex mechanical operations and achieves via formation through the weaving action itself, improving both productivity and cost efficiency.
2Manufacturing precision
If mechanical drilling is used to create via holes, then electrically conductive vias can be formed, but the mechanical stability of the PCB substrate decreases
Solution Approach 1:
The conductive pathways are established through weaving before the resin curing process. This preliminary action creates the electrical interconnections as an integral part of the fabric structure, avoiding any subsequent mechanical penetration that would compromise substrate stability.
Solution Approach 2:
Mechanical drilling is replaced by weaving conductive strands through the fabric layers. The weaving process integrates conductors without creating holes or voids, thereby maintaining the continuous fiber structure and mechanical integrity of the substrate while achieving electrical connectivity.
3Ease of operation
If conventional packaging methods are used, then IC chips can be attached to circuit boards, but stable and clean power, ground, and high frequency signal transmission is not achieved
Solution Approach 1:
The substrate combines non-conductive fabric layers with integrated conductive strands in a composite structure. This composite design provides both mechanical support and electrical interconnection functions, enabling stable power, ground, and high-frequency signal transmission while maintaining ease of chip attachment.
Solution Approach 2:
The conductive strands serve multiple functions simultaneously: providing power transmission, ground connections, and high-frequency signal pathways. This multi-functionality is achieved through the integrated weaving structure that embeds conductive elements directly into the substrate fabric, eliminating the need for separate transmission line structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a substrate package with enhanced mechanical stability, higher yield, and improved signal transmission capabilities, including stable power and high-frequency signal handling, while maintaining comparable costs to existing non-embedded substrates and reducing the need for surface mount passives.
Implementation Method 1
a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands
Implementation Method 2
followed by resin impregnation and curing, which integrates inductors, co-axial PTH, and standard copper-filled PTH directly into the substrate core
Data Source
AI summary
A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.