Wedge Element Chip Cooling Device
Solution Overview
Problem
Current cooling devices for integrated semiconductor components face challenges in achieving efficient heat transfer due to manufacturing tolerances, which result in thermal resistance and require additional materials or increased cooling system costs, noise, and risk of damaging sensitive chips during assembly.
Innovation Solution
A cooling device with a wedge element that creates a wedge-shaped intermediate space between the heat source and heat sink, allowing for lateral adjustment to accommodate manufacturing tolerances and ensuring an uninterrupted, high thermal conductivity connection using a thermally conductive material to bridge any remaining gaps, with a biasing arrangement to secure the wedge element in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gap is left between the circuit board and heat sink to accommodate manufacturing tolerances, then assembly is easier and chips are protected from damage, but thermal resistance increases and heat transfer efficiency deteriorates
Solution Approach 1:
A wedge element is introduced as an intermediary component between the heat source and heat sink. This wedge element fills the gap created by manufacturing tolerances while maintaining high thermal conductivity, thus protecting the chip from direct clamping forces while minimizing thermal resistance. The wedge element acts as a mediator that simultaneously achieves mechanical protection and thermal efficiency.
2Loss of energy
If a larger heat sink or more powerful blower is used to compensate for thermal resistance, then heat dissipation improves, but device complexity, cost, and noise increase
Solution Approach 1:
The invention extracts and eliminates the source of thermal resistance by removing the need for plastically deformable filling materials and replacing them with a high thermal conductivity wedge element. This extraction of the thermal resistance problem allows the existing cooling system to operate efficiently without requiring larger heat sinks or more powerful blowers, thereby maintaining simple device architecture.
3Loss of energy
If the heat sink is directly attached to the chip housing, then heat transfer is maximized, but the risk of damaging the sensitive chip during assembly and operation increases
Solution Approach 1:
The wedge element serves as a protective intermediary between the heat source and heat sink, enabling thermal coupling while preventing direct mechanical contact that could damage the chip. This mediator approach allows heat transfer optimization without exposing the sensitive chip to assembly and operational stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency by eliminating the need for plastically deformable materials and reducing thermal resistance, allowing for effective heat dissipation without damaging the chip, while maintaining structural integrity and reducing noise and costs.
Implementation Method 1
The wedge element has a third and a fourth surface, said surfaces being disposed to abut against the first surface of the heat source or the second surface of the heat sink and to establish a connection displaying high thermal conductivity between them
Implementation Method 2
Thermal energy is removed by forced convection with a blower
Data Source
AI summary
The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.