Welded Converter Cooling Housing for O-Ring-Free Sealing
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Solution Overview
Problem
Existing technologies face challenges in integrating molded and sintered compact half-bridge modules in a closed cooler configuration without using O-rings or screws, while maintaining high reliability and temperature resistance.
Innovation Solution
A converter design that integrates three semiconductor modules in a shared plate using welding technologies, forming a cooling path and sealed container, utilizing laser, friction stir, or arc welding to connect the base plate and cover, with a cooling structure on the substrate for coolant contact, and a base plate material that does not require additional corrosion protection coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If welding technologies are used to connect the base plate to the cooling housing, then the sealing reliability and high-temperature resistance are improved, but the manufacturing complexity increases
Solution Approach 1:
The base plate is integrally formed with the cooling housing through welding, merging two separate components into a unified structure. This eliminates the need for separate sealing elements like O-rings and provides inherent high-temperature resistance, resolving the contradiction between sealing reliability and manufacturing complexity.
Solution Approach 2:
The mechanical fastening system (screws, clips, or interference fits) is replaced with a welding process. This substitution provides superior sealing reliability and high-temperature resistance while simplifying the overall structure by eliminating the need for separate fastening components and assembly steps.
2Loss of energy
If a closed cooler configuration is used to house multiple semiconductor modules, then the heat management efficiency is improved, but the device complexity increases
Solution Approach 1:
Multiple semiconductor modules are integrated into a single closed cooler configuration, merging individual cooling functions into a unified thermal management system. The cooling ribs are integrally formed with the base plate, creating a compact structure that improves heat management efficiency while reducing overall device complexity.
Solution Approach 2:
The base plate serves multiple functions: it provides mechanical support for the semiconductor modules, acts as a heat spreader with integrated cooling ribs, and forms a sealed cooling chamber with the cooling housing. This multi-functionality improves heat management efficiency while reducing the number of separate components needed.
3Temperature
If cooling ribs are added to the base plate to increase surface expansion, then the heat dissipation capability is improved, but the manufacturing complexity increases
Solution Approach 1:
The cooling ribs are integrally formed with the base plate as a single component, merging the heat dissipation structure with the mechanical support structure. This integral formation improves heat dissipation capability by maximizing surface area while avoiding the complexity of assembling separate cooling components.
Solution Approach 2:
The base plate geometry is modified by adding cooling ribs that increase the surface expansion factor. This parameter change (surface area) directly improves heat dissipation capability while the integral formation method keeps manufacturing complexity manageable through a single welding operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a compact, reliable, and high-temperature-resistant solution with a sealed coolant path, avoiding the need for O-rings or screws, and allowing for efficient coolant flow through the cooling structure.
Implementation Method 1
the plate (24) is connected around the hole (25) to the second region (22) of the base plate (17) by welding
Implementation Method 2
the first region (21) having the surface expansion (23) is in direct contact with a coolant liquid, which flows through the cooling structure
Data Source
AI summary
A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding.