Welded Pressure Sensing Sheet With Integrated Circuit Miniaturization
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Solution Overview
Problem
Existing pressure-sensitive key solutions require customization, are large in size, and lack versatility, making them unsuitable for miniaturization and versatile applications.
Innovation Solution
A pressure sensing device comprising at least one pressure sensing sheet connected to a first substrate via welding, with an integrated signal measurement circuit in the semiconductor film, allowing for deformation transmission and electrical signal output without the need for custom structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If existing pressure-sensitive key solutions are used, then pressure sensing function is achieved, but the device size is large and customization is required
Solution Approach 1:
The patent combines the pressure sensing function with the substrate structure itself, making the substrate serve dual purposes as both structural support and sensing element. This integration eliminates the need for separate pressure-sensitive keys and reduces overall device size while maintaining versatility across different applications
Solution Approach 2:
The substrate is designed to serve multiple functions: structural support, signal transmission, and pressure sensing. By making the substrate itself pressure-sensitive through integrated circuits or materials, the device achieves universal applicability without requiring customization for different pressure sensing needs
2Ease of manufacture
If existing pressure-sensitive key solutions are used, then pressure sensing function is achieved, but the structure requires customization
Solution Approach 1:
The patent merges the pressure sensing functionality directly into the substrate, eliminating the need for separate pressure-sensitive key components. This integration simplifies the manufacturing process by reducing the number of parts and assembly steps while lowering structural complexity
3Strength
If foam and structural support are added to pressure keys, then structural integrity is improved, but the device size increases
Solution Approach 1:
The patent employs thin film structures and flexible substrate materials that provide sufficient structural support without adding significant volume. The substrate itself is designed with appropriate mechanical properties to support the pressure sensing function without requiring additional foam or bulky structural elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved versatility and miniaturization of pressure sensing devices by eliminating the need for custom structures and integrating signal detection circuits, thereby enhancing the integration degree and reducing the overall volume of the device.
Implementation Method 1
at least one semiconductor film, fixed on the lower surface and/or the upper surface of the second substrate, wherein a signal measurement circuit is integrated in the at least one semiconductor film, and the signal measurement circuit is configured for detecting an amount of the deformation
Implementation Method 2
the pressure sensing sheet is connected with the first substrate by welding, and welding points are configured for transmitting a deformation and transmitting an electrical signal
Data Source
AI summary
The present application relates to a pressure sensing device and a pressure sensing apparatus. The pressure sensing device (20) includes: one or more pressure sensing sheet (10), and a first substrate (22) configured for carrying the pressure sensing sheet (10); the pressure sensing sheet (10) is connected with the first substrate (22) by welding, and welding points are configured for transmitting a deformation and transmitting an electrical signal, and the pressure sensing sheet includes at least one semiconductor film (12), and a signal measurement circuit is integrated in the at least one semiconductor film (12), and the signal measurement circuit is configured for detecting an amount of the deformation and outputting the electrical signal that is able to be identified. Integrating the signal detection circuit in the semiconductor film (12) is greatly reduce the volume of the structure, which is beneficial to improve the integration degree of the product, and is beneficial to the miniaturization of the product.