Welding Power Supply Cooling via Integrated Circuit Board
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Solution Overview
Problem
Existing power supplies for high-temperature metal processing systems face challenges with high operational costs, large size, complex designs, and vulnerability to environmental contaminants due to inefficient cooling systems that allow moisture and contaminants to enter, leading to increased maintenance time and reduced efficiency.
Innovation Solution
A cooling system featuring a heat sink with a base and fins forming channels, enclosed by a panel, and a fan directing gas flow through these channels to maintain low operational temperatures while minimizing size and exposure to contaminants, with a design that separates electrical components from the airflow to prevent moisture and contaminant exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-generating components are spaced apart to permit air circulation, then cooling efficiency is improved, but power supply size increases
Solution Approach 1:
The patent combines multiple heat-generating components (transformer, rectifier, inverter) onto a single circuit board, eliminating the need for spatial separation while maintaining effective cooling. This integration allows all components to be cooled uniformly by the forced-air system without requiring a large volume for air circulation paths.
Solution Approach 2:
The patent employs a forced-air cooling system using a fan to actively circulate cooling air through the power supply. This pneumatic approach enables efficient heat removal from densely packed components on the circuit board without requiring large physical spacing between components, thus reducing overall power supply size while maintaining cooling effectiveness.
2Temperature
If components are mounted separately and hardwired, then cooling air circulation is improved, but manufacturing and repair complexity increases
Solution Approach 1:
The patent integrates all heat-generating components (transformer, rectifier, inverter) onto a single circuit board, dramatically simplifying manufacturing and repair processes. Instead of separately mounting and hardwiring multiple components, the integrated board can be manufactured as a complete assembly and replaced as a single unit if needed, reducing both manufacturing steps and repair time.
Solution Approach 2:
The forced-air cooling system is designed to blow air across the entire circuit board surface, effectively cooling all integrated components simultaneously. This approach maintains good thermal management while working with the simplified single-board architecture, eliminating the need for complex individual component mounting arrangements.
3Temperature
If forced-air cooling is used, then heat removal is improved, but moisture and contaminants enter the power supply
Solution Approach 1:
The patent uses a controlled forced-air cooling system where air is drawn through the power supply in a specific direction (front to back) and exhausted through designated outlets. This controlled airflow path limits the ingress of moisture and contaminants compared to uncontrolled natural convection, as the air is channeled through specific openings rather than allowing unrestricted environmental exposure.
Solution Approach 2:
The power supply is divided into distinct functional zones: a clean zone where electrical components are located and a dirty zone where the fan and air intake are positioned. This segmentation isolates the sensitive electronics from direct exposure to environmental contaminants while maintaining effective cooling through the controlled airflow path between zones.
4Volume of moving object
If components are densely packed, then power supply size is reduced, but cooling efficiency decreases
Solution Approach 1:
The patent achieves high component density by integrating all heat-generating components onto a single circuit board. This dense integration is made possible by the forced-air cooling system that can effectively remove heat from closely spaced components, thus achieving small power supply size without sacrificing cooling efficiency.
Solution Approach 2:
The forced-air cooling system provides high-velocity air flow that can efficiently remove heat from densely packed components on the circuit board. The active air circulation compensates for the reduced thermal convection space, enabling effective cooling of compact, densely integrated components and thus achieving small power supply dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces operational costs, minimizes power supply size, and enhances environmental resilience by maintaining low operational temperatures and protecting internal components from moisture and contaminants, thereby improving efficiency and reducing maintenance time.
Implementation Method 1
A fan can be aligned with the heat sink that can direct a gas flow to the central portion
Implementation Method 2
a heat sink that can have a base and a plurality of fins extending from the base
Data Source
AI summary
An improved system for cooling a power supply of a welding or plasma cutting system, and an improved configuration of a power supply. The system cools achieves the improvement in configuration and cooling by mounting electrical components to a circuit board and then to a heat sink. Electrical components are also mounted to a common panel that improves the circulation of air. A central panel supporting the power supply heat sink and components allows a smaller and more compact design while maintaining proper temperatures. Electromagnet cooling is improved by modifying electromagnetic cores to conduct heat to the heat sink, and by the use of thermally conducting polymers.