Wet Etching Glass Nanoscale Patterns Hydrofluoric Acid Surfactant
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Solution Overview
Problem
Conventional wet etching methods struggle to achieve high transmittance and low reflectance in glass surfaces while maintaining stability, reproducibility, and etching uniformity, especially in forming nanoscale patterns that effectively control light transmittance and reflectance.
Innovation Solution
A wet etching method involving a solution of hydrofluoric acid, surfactant, and optional oxalic or acetic acid is used to create nanoscale patterns on glass surfaces, with a dipping process that forms protrusions with specific thickness and depth ranges, enhancing transmittance and reducing reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional wet etching is used to form patterns on glass, then process management and mass-production are easy, but the pattern width is large (3 micrometers or more) which reduces light transmittance
Solution Approach 1:
The patent changes the chemical parameters of the etching solution by using hydrofluoric acid in a specific concentration range (0.1-5 wt%) combined with surfactants and chelating agents. This parameter modification enables the formation of nanoscale patterns (1-100 nm width) while maintaining the simplicity and scalability of wet etching processes for mass production.
2Manufacturing precision
If dry etching is used to form nanoscale patterns, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent replaces the complex mechanical and plasma-based dry etching system with a simplified chemical wet etching system. By substituting the etching mechanism from physical/chemical plasma reactions to straightforward chemical dissolution using hydrofluoric acid-based solutions, the process achieves nanoscale precision without requiring complex equipment or sophisticated process control.
3Manufacturing precision
If conventional wet etching is used to form nanoscale patterns, then manufacturing precision is improved, but etching uniformity and stability deteriorate
Solution Approach 1:
The patent introduces surfactants and chelating agents as intermediary substances in the etching solution. These additives mediate between the hydrofluoric acid and the glass surface, ensuring uniform distribution of etching activity and stable reaction conditions. The surfactants reduce surface tension and improve wetting, while chelating agents control metal ion concentrations, together achieving consistent nanoscale pattern formation across large areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high transmittance and low reflectance in glass, improving visibility and display quality, particularly in mobile devices, with enhanced stability and reproducibility of the etching reaction.
Implementation Method 1
the wet etching is generally performed through a chemical reaction between a base material to be etched and an etching solution having a property of corroding and dissolving the base material
Implementation Method 2
A wet etching solution used in the wet etching may include hydrofluoric acid and a surfactant
Data Source
AI summary
A wet etching method according to the present disclosure includes cleaning the glass, forming a nanoscale pattern by wet-etching the cleaned glass, and cleaning and drying the nano-patterned glass, wherein a wet etching solution used in the wet etching includes hydrofluoric acid and a surfactant. According to the present disclosure, a glass having high transmittance/low reflectance can be provided. The glass can be applied to an optical device and a display including a mobile device.