Wet Microchip Alignment Using Grooved Transfer Substrates
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Solution Overview
Problem
The pick and place method for transferring micro-LED chips in display apparatus manufacturing faces challenges with decreasing transfer yield rates as micro-LED sizes decrease and display apparatus sizes increase.
Innovation Solution
A wet alignment method for micro-semiconductor chips, involving the supply of a liquid to grooves in a transfer substrate, followed by the alignment of micro-semiconductor chips using a liquid absorber that scans the substrate, allowing the chips to be accurately positioned within the grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pick and place method is used for transferring micro-LED chips, then transfer process can be performed, but transfer yield rate decreases as micro-LED size decreases and display apparatus size increases
Solution Approach 1:
The patent replaces the mechanical pick and place method with a wet alignment method using liquid flow and capillary forces. Liquid is supplied to grooves on the transfer substrate, creating capillary forces that automatically align and hold micro-LED chips in position during transfer, eliminating the need for mechanical gripping and placement operations that fail at small scales.
Solution Approach 2:
The patent uses liquid (hydraulic principle) supplied to grooves on the transfer substrate to create capillary forces for chip alignment and holding. The liquid flow and capillary action provide the necessary forces to position micro-LED chips accurately without mechanical contact, enabling high-yield transfer of small-sized chips.
2Reliability
If pick and place method is used for transferring micro-LED chips, then transfer process can be performed, but transfer yield rate decreases as display apparatus size increases
Solution Approach 1:
The patent segments the transfer substrate into multiple grooves that can simultaneously hold and align multiple micro-LED chips. This segmented structure allows parallel processing of many chips across large display areas, maintaining high transfer yield rates even as display apparatus size increases, unlike sequential pick and place methods.
3Manufacturing precision
If wet alignment method is used with liquid supply to grooves, then alignment accuracy is improved, but process complexity increases
Solution Approach 1:
The patent employs self-service alignment where liquid supplied to grooves automatically creates capillary forces that align micro-LED chips without requiring complex external alignment equipment or procedures. The system uses its own liquid supply mechanism to achieve precise alignment, simplifying the overall process despite the added liquid supply component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the alignment efficiency and accuracy of micro-semiconductor chips on a transfer substrate, improving the transfer yield rate even for smaller micro-LEDs and larger display apparatuses.
Implementation Method 1
aligning the plurality of micro-semiconductor chips with the plurality of grooves by scanning the transfer substrate by using a liquid absorber
Data Source
AI summary
A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.